Gas Spraying Apparatus Nozzle Control for Substrate Processing

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Solution Overview

Problem

Existing substrate processing apparatuses face inefficiencies in controlling gas density distribution due to manual ON and OFF controls of nozzles, leading to reduced process switching efficiency and productivity.

Innovation Solution

A gas spraying apparatus with a spray control unit that automatically controls nozzle operation to achieve targeted gas density distributions by selecting from stored types and controlling the operation of spray valves based on the substrate process, allowing for precise gas distribution management.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If manual ON and OFF controls of each nozzle are used, then gas density distribution can be adjusted for different process types, but process switching efficiency and productivity are lowered

Engineering Contradiction:
Improvegas density distribution controlVSAvoidprocess switching efficiency
Core Design Contradiction:
Adaptability or versatilityVSProductivity

Solution Approach 1:

The system pre-stores multiple nozzle control patterns corresponding to different process types in memory. When a process is selected, the corresponding pre-prepared control pattern is automatically retrieved and applied, eliminating the need for manual adjustment of each nozzle during process switching.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The control system automatically selects and applies the appropriate nozzle control pattern based on the selected process type, without requiring manual intervention. The system serves itself by automatically matching process requirements with the correct pre-stored control configuration.

Inventive Principle:
Principle #25Self-service

2Manufacturing precision

If manual control of multiple nozzles is required for different process types, then gas density distribution can be optimized, but operation complexity and time consumption increase

Engineering Contradiction:
Improvegas density distributionVSAvoidnozzle control operation
Core Design Contradiction:
Manufacturing precisionVSEase of operation

Solution Approach 1:

Optimal nozzle control patterns for different process types are pre-calculated and stored in memory before actual processing. This preliminary preparation eliminates the need for complex manual adjustments during operation, maintaining precision while simplifying the operational process.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The system uses stored copies of proven nozzle control patterns for different process types. Instead of manually creating optimal control configurations each time, the system retrieves pre-established control patterns that have been optimized for specific processing requirements.

Inventive Principle:
Principle #26Copying

3Manufacturing precision

If individual nozzle control is implemented, then gas density distribution can be precisely controlled, but device complexity increases

Engineering Contradiction:
Improvegas density distribution controlVSAvoidnozzle control system
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

Complex control patterns for individual nozzles are pre-computed and stored, transforming the complexity from operational time to setup time. The actual processing operation becomes simple pattern selection and application, maintaining precise control while reducing operational complexity.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The system manages complexity by changing the state of control from real-time manual adjustment to automated retrieval of pre-defined parameter sets. Each nozzle's control state is managed through stored patterns that define opening/closing sequences and timing, simplifying the operational interface while maintaining precise individual control.

Inventive Principle:
Principle #35Parameter changes

Data Source

PatentUS11136670B2Gas spraying apparatus, substrate processing facility including the same, and method for processing substrate using substrate processing facility
Publication Date: 2021.10.05 AP SYST INC
  • US11136670B2 patent drawing
  • US11136670B2 patent drawing
  • US11136670B2 patent drawing

AI summary

A gas spraying apparatus according to the embodiment of the present invention includes a spray part disposed and aligned on one side outside a substrate in the width direction of the substrate, and having a plurality of nozzles for spraying gas toward the substrate, and a spray control unit for automatically controlling whether or not each of a plurality of nozzles sprays gas such that a gas density distribution type in the width direction of the substrate becomes a targeted gas density distribution type by the gas sprayed through the plurality of nozzles. Therefore, according to the embodiment of the present invention, it is easy to carry out the process with a plurality of types of process types or a plurality of types of gas density distribution types, and a time for adjusting the open or close operation of the plurality of nozzles can be shortened.