Gas Storage Tank Heating by Process Chamber Contact

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Solution Overview

Problem

In single-wafer-type substrate processing, achieving high aspect ratio film coverage while minimizing energy consumption is challenging due to the need for uniform heating of gas tanks, which often results in inefficient energy use.

Innovation Solution

A substrate processing apparatus with a process container and storage tanks that are partially in contact with the outer wall, using a temperature regulator to control the internal temperature of the tanks, reducing thermal decomposition and allowing for efficient heat reuse from the process container.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If tanks are heated uniformly to improve gas supply performance, then coverage performance is improved, but energy consumption increases

Engineering Contradiction:
Improvecoverage performanceVSAvoidenergy consumption
Core Design Contradiction:
Manufacturing precisionVSUse of energy by moving object

Solution Approach 1:

The process container's heated wall automatically serves as the heating source for the tanks, eliminating the need for separate heating devices. The tanks self-regulate their temperature by thermal contact with the process container wall, achieving uniform heating without additional energy input.

Inventive Principle:
Principle #25Self-service

Solution Approach 2:

The heating function is merged into the process container wall, which simultaneously serves as both the process heating element and the tank heating source. This consolidation eliminates redundant heating devices and reduces overall energy consumption while maintaining effective tank heating.

Inventive Principle:
Principle #5Merging (Combining)

2Stability of the object's composition

If heating devices are added to warm tanks uniformly, then temperature uniformity is improved, but device complexity increases

Engineering Contradiction:
Improvetemperature uniformityVSAvoiddevice complexity
Core Design Contradiction:
Stability of the object's compositionVSDevice complexity

Solution Approach 1:

The tanks utilize the process container wall's heat automatically through thermal contact, eliminating the need for separate heating devices and temperature control systems. This self-heating mechanism maintains temperature uniformity without adding device complexity.

Inventive Principle:
Principle #25Self-service

Solution Approach 2:

The process container wall performs multiple functions: it heats the process space and simultaneously serves as the heating source for the tanks. This multi-functionality eliminates the need for dedicated tank heating devices, reducing overall system complexity.

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Productivity

If tanks are installed at gas supply pipes for batch processing, then gas supply efficiency is improved, but heat loss increases

Engineering Contradiction:
Improvegas supply efficiencyVSAvoidheat loss
Core Design Contradiction:
ProductivityVSLoss of energy

Solution Approach 1:

The tanks are positioned to thermally contact the process container wall, merging the process heating function with the tank heating function. This eliminates redundant heating and reduces heat loss to the environment, while maintaining efficient gas supply capability.

Inventive Principle:
Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enhances film characteristics by preventing thermal decomposition and reducing energy consumption, achieving improved coverage performance while saving energy by utilizing heat from the process container.

Implementation Method 1

a storage container which is at least partially in contact with an outer wall of the process container and is configured to store a gas to be supplied into the process container

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS20230416916A1Substrate processing apparatus, method of manufacturing semiconductor device, and recording medium
Publication Date: 2023.12.28 KOKUSAI DENKI KK
  • US20230416916A1 patent drawing
  • US20230416916A1 patent drawing
  • US20230416916A1 patent drawing

AI summary

A technique includes a process container configured to process a substrate, a storage container which is at least partially in contact with an outer wall of the process container and is configured to store a gas to be supplied into the process container, and a temperature regulator configured to regulate an internal temperature of the storage container.