Gas Electron Multiplier Foil with Thick Insulation Layer
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Solution Overview
Problem
Conventional gas electron multipliers suffer from electron spread issues, leading to poor positional resolution despite achieving high electron multiplication factors, making it difficult to obtain clear detection images.
Innovation Solution
A single gas electron multiplication foil with a thicker insulation layer, composed of a multilayer body with macromolecular polymer material and flat metal layers, is used to reduce electron spread while maintaining a high multiplication factor, employing a through-hole structure for enhanced electric field condensation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple gas electron multiplication foils are used in stages to increase electron multiplication factor, then the electron multiplication factor is improved, but electron spread increases and positional resolution deteriorates
Solution Approach 1:
The patent merges multiple insulation layers into a single thick insulation layer structure. Instead of using multiple separate GEM foils stacked together, the invention combines the functionality of multiple layers into one integrated foil with a thicker insulation layer, thereby maintaining high electron multiplication while reducing electron spread and improving positional resolution.
2Measurement precision
If the insulation layer thickness is increased to reduce electron spread, then positional resolution is improved, but the electron multiplication factor may be degraded
Solution Approach 1:
The patent changes the thickness parameter of the insulation layer from the conventional range (50 μm) to a thicker range (100 μm to 300 μm). This parameter change allows the structure to reduce electron spread and improve positional resolution while the specific thickness range is optimized to maintain adequate electron multiplication factor.
3Device complexity
If a single thick insulation layer is used instead of multiple thin layers, then device complexity is reduced and electron spread is reduced, but manufacturing precision requirements increase
Solution Approach 1:
The patent segments the thick insulation layer by forming through-hole structures that extend through the entire thickness. This segmentation approach allows the single thick layer to function similarly to multiple layers by creating discrete electron multiplication regions, while simplifying the overall device structure and reducing the number of components that need to be assembled.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces electron spread and improves positional resolution without degrading the electron multiplication factor, resulting in clearer detection images and more precise data acquisition.
Implementation Method 1
it uses electron avalanche effects to multiply photoelectrons released from gas atoms as a result of the interaction between radiation and a gas through photoelectric effects
Implementation Method 2
it uses electron avalanche effects to multiply photoelectrons released from gas atoms
Implementation Method 3
a large number of through-holes 108d, 110d are formed for condensing the electrical field in the first gas electron multiplication foil 108 and the second gas electron multiplication foil 110, respectively
Data Source
AI summary
To attain objects to reduce the spread of electrons as compared with a conventional one without degrading the multiplication factor of electrons; to provide a large electron multiplication factor; and to improve positional resolution, there is provided a gas electron multiplier using interaction between radiation and gas through photoelectric effects including: a chamber filled with gas and a single gas electron multiplication foil arranged in the chamber wherein the gas electron multiplication foil is made of a plate-like multilayer body composed by having a plate-like insulation layer made of a macromolecular polymer material having a thickness of around 100 μm to 300 μm and flat metal layers overlaid on both surfaces of the insulation layer, and the plate-like multilayer body is provided with a through-hole structure.