Gimbaled Pick-Up Head for Void-Free Die Bonding Alignment
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Solution Overview
Problem
Conventional pick-up heads for die bonding lack self-alignment and flexibility, leading to void formation between the die and the carrier due to air trapping, non-uniform bonding material distribution, and uneven pressure application, which becomes more critical with larger die sizes.
Innovation Solution
A self-aligning pick-up head with a gimbaled nozzle and base tool configuration, featuring a spherical surface and pin mechanism, allowing for tiltable and pivotal movement, ensures uniform force distribution and precise alignment during die bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a conventional fixed pick-up head is used, then the structure is simple, but the alignment precision deteriorates leading to void formation
Solution Approach 1:
The pick-up head incorporates a gimbal mechanism that allows the nozzle to dynamically adjust its orientation in real-time. The spherical interface between the nozzle and base tool enables automatic alignment through controlled movement, transforming a static structure into a dynamic self-aligning system that maintains precision without excessive complexity
Solution Approach 2:
The self-aligning pick-up head uses the spherical contact interface to automatically correct misalignment. The geometry of the spherical surfaces and pin configuration creates a self-correcting mechanism where the nozzle naturally aligns itself during the picking operation, eliminating the need for complex external alignment systems
2Adaptability or versatility
If a fixed nozzle design is used, then the device complexity is low, but the adaptability to different die sizes deteriorates
Solution Approach 1:
The gimbal-mounted nozzle can tilt and pivot to accommodate different die sizes and bonding locations. This dynamic adjustment capability allows the same pick-up head to handle various die dimensions by changing its orientation, providing versatility without requiring multiple specialized nozzles
Solution Approach 2:
The self-aligning pick-up head with gimbal mechanism serves multiple functions: it can pick up dies of different sizes, adjust to various bonding locations, and maintain uniform force distribution across different package types. This multi-functional design replaces what would otherwise require multiple specialized devices
3Reliability
If uniform force distribution is not achieved, then the bonding quality deteriorates with void formation, but increasing pressure application worsens air trapping
Solution Approach 1:
The self-aligning mechanism ensures that the nozzle maintains optimal orientation during bonding, distributing force uniformly across the die surface. This dynamic alignment prevents concentrated pressure points that would trap air, while still applying sufficient overall pressure for reliable bonding
Solution Approach 2:
The patent replaces complex mechanical pressure control systems with a geometric self-aligning mechanism. The spherical interface and pin configuration automatically ensure uniform force distribution through proper alignment, eliminating the need for complex pressure regulation mechanisms
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The self-aligning pick-up head achieves uniform force distribution and reduces void formation, effectively bonding chips of any size with improved precision and accuracy, applying forces up to 10 kg×m/s2, and is adaptable for various bonding methods.
Implementation Method 1
a nozzle (110) comprising at least a portion of a spherical surface and a first end portion (111, 112, 113), wherein the portion of the spherical surface of the nozzle (110) is placed on the portion of the spherical surface of the recess (128)
Implementation Method 2
placing at least one pin in a spherical end portion of a nozzle and connecting the nozzle to a base tool by mounting a cover on a first main surface of the base tool such that the nozzle is gimbaled relative to the base tool
Data Source
AI summary
A self-aligning pick-up head, a method to manufacture a pick-up head and a method of manufacturing a device are disclosed. In one embodiment a pick-up head includes a nozzle having a first end portion and a second end portion and a base tool comprising a collet head, wherein the first end portion of the nozzle is gimbaled to the base tool.