Glass Carrier Semiconductor Assembly Melted Surface Bonding
Solution Overview
Problem
Existing assemblies of glass carriers with optoelectronic semiconductor components face challenges in achieving long-term stability and resistance to heat and light, particularly due to the use of organic substances in mechanical connections.
Innovation Solution
A method and assembly where the optoelectronic semiconductor component connects to a glass carrier via a melted glass surface, eliminating the need for organic materials and ensuring a stable, long-term connection by using the same or different glass compositions for the carrier and the melted surface, which maintains the optoelectronic properties and refractive index.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If organic substances are used to mechanically connect the semiconductor component to the glass carrier, then the assembly can be easily manufactured, but the connection lacks long-term stability and resistance to heat and light
Solution Approach 1:
The patent replaces the organic mechanical connection system with a direct glass-to-semiconductor connection system. The glass carrier is melted at its connection surfaces to form a glass melt that directly bonds to the semiconductor component, eliminating the need for organic adhesives or mechanical fasteners. This substitution provides superior long-term stability and resistance to heat and light while maintaining manufacturing feasibility through controlled melting processes.
Solution Approach 2:
The patent utilizes parameter changes by controlling the temperature of the glass carrier to transition the glass material from a solid state to a melted state at the connection surfaces. By heating the glass carrier to its melting point, the glass forms a liquid melt that can flow and bond directly to the semiconductor component. After bonding, the system is cooled to return the glass to its solid state, creating a stable permanent connection. This parameter change enables the connection process without requiring organic substances.
2Reliability
If a melted glass surface is used to connect the semiconductor component to the carrier, then the connection becomes insensitive to heat and light with long-term stability, but the manufacturing process becomes more complex
Solution Approach 1:
The patent merges the glass carrier and semiconductor component into a unified structure through direct bonding. The melted glass surface of the carrier fuses with the semiconductor component, creating an integrated assembly where the connection interface becomes indistinguishable from the bulk materials. This merging eliminates the need for separate connection structures or intermediate layers, providing inherent resistance to heat and light while actually simplifying the overall device structure compared to multi-layer organic connection systems.
3Stability of the object's composition
If the same glass material is used for both the carrier and the melted surface, then the optoelectronic properties and refractive index are maintained, but the manufacturing precision requirements increase
Solution Approach 1:
The patent applies local quality by maintaining the bulk glass carrier in its original solid state with stable optoelectronic properties, while only the local connection surfaces are melted to form bonds. This localized melting approach allows the majority of the glass carrier to retain its precise optical characteristics and refractive index, while the melted regions provide mechanical and thermal bonding. The local quality principle reduces the overall manufacturing precision requirements compared to melting the entire carrier, as only small surface areas require precise temperature control.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach provides a secure, long-term stable connection insensitive to heat and light, allowing for defined electromagnetic radiation propagation and flexible material properties, enhancing the assembly's mechanical and optical performance.
Implementation Method 1
at least one surface of the semiconductor component connects to the carrier via a melted surface including glass
Data Source
AI summary
An assembly includes a carrier including a glass material, including at least one recess, wherein at least one optoelectronic semiconductor component is arranged in the at least one recess of the carrier, and at least one surface of the semiconductor component connects to the carrier via a melted surface including glass.