Glass Cavity Packaging Substrate for High-Speed Signal and Heat Dissipation
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Solution Overview
Problem
Conventional semiconductor packaging technologies fail to support high-performance and high-frequency semiconductor elements due to high resistance and limited wiring pitch reduction, and generate heat during operation without effective heat dissipation solutions.
Innovation Solution
A packaging substrate with a glass substrate and cavity structure, featuring a core layer with glass via connections and a cavity unit for semiconductor elements, along with a heat-emitting unit for thermal management and supporting units for precise element positioning.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a ceramic substrate is used for packaging, then high mechanical strength is achieved, but high resistance and high dielectric constant prevent mounting of high-performance and high-frequency semiconductor elements
Solution Approach 1:
The patent employs a composite substrate structure combining glass substrate with ceramic layers. The glass substrate provides low dielectric constant and low loss characteristics for high-frequency performance, while the ceramic layers provide mechanical strength and thermal management. This composite approach resolves the contradiction between mechanical strength and electrical performance by integrating materials with complementary properties.
2Reliability
If a resin substrate is used for packaging, then high-performance and high-frequency semiconductor elements can be mounted, but wiring pitch reduction is limited
Solution Approach 1:
The patent uses a composite structure where the glass substrate enables fine wiring pitch through its low dielectric constant properties, while integrated ceramic components provide the necessary mechanical support. This allows wiring pitch reduction beyond what resin substrates alone can achieve, while maintaining electrical performance for high-frequency applications.
3Reliability
If silicon or glass substrate with through-via is used, then length of conductive lines is shortened and excellent electric characteristics are achieved, but manufacturing complexity increases
Solution Approach 1:
The patent segments the substrate into distinct glass and ceramic portions, with through-vias formed in the glass substrate to create direct conductive paths. This segmentation allows shortening of conductive lines and achievement of excellent electrical characteristics while managing manufacturing complexity through a modular approach where each material section performs its specialized function.
4Power
If semiconductor package generates heat during driving, then operational functionality is maintained, but heat dissipation becomes a limiting factor for high-performance applications
Solution Approach 1:
The patent introduces a heat-emitting unit as an intermediary component between the semiconductor element and the external environment. This unit facilitates heat dissipation by providing a dedicated thermal pathway, allowing the semiconductor package to maintain operational functionality at high power levels while effectively managing the generated heat through the glass-ceramic composite structure.
Data Source
AI summary
An embodiment relates to a packaging substrate and a semiconductor device. The semiconductor device includes an element unit having a semiconductor element and a packaging substrate electrically connected to the element unit. A glass substrate is applied as a core of the packaging substrate to improve electrical performance, such as signal transmission rate, by reducing the connection distance between the semiconductor element and a motherboard. The structure enables shorter signal transmission paths, suppresses the generation of parasitic elements, and simplifies processing of the insulating layer. As a result, the packaging substrate is suitable for high-speed circuit applications.