Integrally Bonding Glass to Ceramic via Heated Contact Element
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Solution Overview
Problem
Existing methods for bonding glass elements to carrier elements, such as in optical devices, often suffer from instability due to material combinations and the use of adhesive layers, which can lead to component failure over time.
Innovation Solution
A method of integrally bonding a glass element to a carrier element using a contact element inserted into a contact recess on the carrier element, followed by local heating to create a material bond without the use of adhesives.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If adhesive layers are used to bond glass elements to carrier elements, then bonding is achieved, but component failure occurs due to ageing
Solution Approach 1:
The invention extracts and eliminates the adhesive layer from the bonding system. Instead of using adhesives to bond the glass element to the carrier element, the patent uses a contact element that is inserted into a contact recess and locally heated to create a direct material bond, thereby removing the source of ageing-related failure.
Solution Approach 2:
The contact element serves as an intermediary component between the glass element and the carrier element. It is inserted into a contact recess in the carrier element and locally heated to create a material bond, mediating the connection without requiring adhesive layers that are prone to ageing.
2Reliability
If direct welding is used to connect glass with very low coefficient of thermal expansion to Si/SiC ceramics, then bonding is achieved, but carbon monoxide and carbon dioxide formation occurs
Solution Approach 1:
The contact element acts as an intermediary that prevents direct contact and reaction between the glass element and the Si/SiC ceramic carrier element. By inserting the contact element into a contact recess and locally heating it, a material bond is created without direct welding of glass to ceramic, thereby avoiding carbon monoxide and carbon dioxide formation.
Solution Approach 2:
The bonding interface is segmented into three distinct components: the glass element, the contact element, and the carrier element. This segmentation prevents direct harmful reactions between glass and Si/SiC ceramic while maintaining bonding strength through the intermediate contact element.
3Shape
If adhesive-free connection is used to maintain flat surface, then surface flatness is achieved, but bonding strength may be compromised
Solution Approach 1:
The invention replaces mechanical adhesive bonding with a thermally-induced material bond. By locally heating the contact element to its melting temperature, the softened material creates a strong material bond between the glass element and carrier element without requiring adhesive layers, thereby maintaining surface flatness while ensuring bonding strength.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method achieves a strong, adhesive-free connection between glass and ceramic elements, ensuring stability even under temperature fluctuations, and is suitable for high-precision applications like optical devices.
Implementation Method 1
melted material from the contact element can wet the glass element to create a connection in the sense of a soldering process
Implementation Method 2
the contact element can be heated above its melting temperature, wherein the softened glass can wet the carrier element or the barrier layer covering the carrier element
Implementation Method 3
create a connection in the sense of a soldering process
Implementation Method 4
create a connection in the sense of a welding process
Implementation Method 5
connect the glass element to the carrier element via the contact element
Data Source
AI summary
A method of integrally bonding a glass element to a support element, the method comprising a step of inserting at least one contact element into a contact recess in a surface of the support element. In addition, the method comprises a step of placing the glass element on a portion of the contact element which portion protrudes beyond the surface, and a step of locally heating the contact element in order to connect the glass element to the carrier element via the contact element. The method also comprises a step of coating at least a part of the contact recess with a separating layer prior to the step of insertion.


