Glass-Core IC Package Edge Features for Crack-Resistant Singulation
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Solution Overview
Problem
Glass cores in integrated circuit packages are susceptible to mechanical and thermal stresses during the singulation process, leading to crack formation and propagation, which compromises the structural integrity and reliability of microelectronic assemblies.
Innovation Solution
Incorporating edge features such as a dielectric layer with materials like dry film photoresist, water-soluble materials, or thermal decomposable materials during or after singulation to mitigate crack formation and propagation in glass cores.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If glass cores are used in integrated circuit packages, then rigidity and thermal properties are improved, but susceptibility to mechanical and thermal stresses increases
Solution Approach 1:
A buffer material layer is applied over the glass core before singulation to cushion and absorb mechanical stresses during the cutting process. This buffer layer prevents direct stress transmission to the glass core, thereby preventing crack formation while maintaining the glass core's rigidity benefits.
Solution Approach 2:
The buffer material acts as an intermediary between the mechanical cutting tool and the glass core during singulation. This intermediary layer mediates the stress interaction, protecting the glass core from direct mechanical damage while allowing the singulation process to proceed.
2Temperature
If glass cores are used in integrated circuit packages, then thermal properties and electrical insulation are improved, but crack formation during singulation increases
Solution Approach 1:
The buffer material layer is applied beforehand to cushion thermal and mechanical stresses during singulation. This prevents crack formation in the glass core while preserving its excellent thermal properties and electrical insulation characteristics.
3Reliability
If buffer material is applied over glass core, then crack propagation is reduced, but additional processing steps are required
Solution Approach 1:
The buffer material application is merged with existing packaging processes, and the buffer layer serves multiple functions including stress cushioning, crack propagation prevention, and potential etch masking. This integration reduces the net increase in processing complexity while achieving reliable crack protection.
Data Source
AI summary
Disclosed herein are microelectronic assemblies and related devices and methods. In some embodiments, a microelectronic assembly may include a glass layer having a first surface, a second surface opposite the first surface, and a side surface extending between the first surface and the second surface, wherein the side surface protrudes at a middle of the glass layer; a dielectric layer at the first surface of the glass layer; and a recess in the dielectric layer at the first surface of the glass layer. In other embodiments, a microelectronic assembly may include a dielectric layer at a surface of a glass layer and a material along a side surface of the dielectric layer, the material including a dry film photoresist, a water-soluble material, a thermal decomposable material, or a non-filled polymeric material. In other embodiments, the dielectric layer may include a conductive bulk material along a side surface.