Embedded Glass Core Patch for IC Interconnect Yield
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Solution Overview
Problem
Current electronic packaging methods, such as Embedded Multi-die Interconnect Bridge (EMIB), face challenges with high cumulative Bump Thickness Variation (BTV) and increasing costs as well as yield decreases with finer bump pitches, necessitating a more efficient approach for interconnecting integrated circuit (IC) dice.
Innovation Solution
Incorporating a thin glass core into the substrate package with encapsulating material, such as a mold or dielectric matrix, to facilitate finer die-to-die interconnections while accommodating existing manufacturing infrastructure, reducing handling complexities and capital expenditures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If EMIB packaging approach is used to enable high-density interconnects, then die-to-die connection density is improved, but cumulative Bump Thickness Variation increases and yield decreases
Solution Approach 1:
The patent introduces a glass core as an intermediary substrate between IC dice to enable fine-pitch interconnections. The glass core provides a stable platform for bump formation and alignment, acting as a mediator that decouples the precision requirements from the final assembly process, thereby maintaining high connection density while improving yield
Solution Approach 2:
The patent changes the substrate material parameter from silicon (in EMIB) to glass, which offers superior dimensional stability and lower thermal expansion. This parameter change reduces bump thickness variation and enables finer pitch interconnections with improved manufacturing precision and yield
2Manufacturing precision
If multiple bridges are embedded to achieve finer bump pitches, then interconnection density is improved, but manufacturing cost increases
Solution Approach 1:
The patent segments the glass core into multiple sections or layers, each handling specific interconnection functions. This segmentation allows for modular manufacturing where each segment can be processed and assembled independently, reducing overall manufacturing complexity and cost while achieving fine bump pitches
Solution Approach 2:
The glass core serves as an intermediary that simplifies the manufacturing process by providing pre-formed bump structures and alignment features, eliminating the need for complex multi-bridge embedding procedures and reducing manufacturing costs
3Loss of energy
If thin glass core is used to reduce signal losses, then signal integrity is improved, but handling complexity increases
Solution Approach 1:
The patent combines the thin glass core with encapsulating material in a single integrated structure. The encapsulating material protects the fragile glass core and provides mechanical strength, merging the signal integrity benefits of thin glass with the handling ease of robust encapsulation
Solution Approach 2:
The encapsulating material provides beforehand cushioning and protection to the thin glass core during manufacturing and assembly processes. This prior protection reduces handling complexity by preventing damage to the fragile glass structure while maintaining its signal integrity benefits
Data Source
AI summary
An electronic device comprises a mold layer that includes multiple integrated circuit (IC) dice having contact pads, a glass core patch embedded in encapsulating material that surrounds the top, bottom, and sides of the glass core patch, and a first redistribution layer arranged between the first mold layer and the glass core patch. The first redistribution layer includes electrically conductive interconnect that electrically connects one or more contact pads of the IC dice to the glass core patch.