Glass-Core PIC Package for Dense Interconnects and Optical Access
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Solution Overview
Problem
Current photonic integrated circuit (PIC) packaging faces challenges in achieving high-density, high-bandwidth electrical communication and simultaneous optical access, with fragile fiber pigtails leading to manufacturing complexities and reduced yields due to handling issues, and existing interconnect technologies suffering from low vertical and horizontal interconnect density.
Innovation Solution
Incorporating a glass core into the package substrate with a dielectric material containing conductive pathways, allowing for high-density interconnects and optical transmission, enabling electrical coupling with processor integrated circuits (XPU) and optical coupling with external fiber connectors through the glass core.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If fiber pigtails are used for optical connections, then optical access is achieved, but manufacturing complexity increases and yield decreases due to handling issues
Solution Approach 1:
The patent extracts the optical connection function from fragile external fiber pigtails and integrates it directly into the package substrate through glass core waveguides. This eliminates the need for separate fiber pigtail components and their associated handling operations, thereby reducing manufacturing complexity and improving yield while maintaining optical access capability.
Solution Approach 2:
The patent merges the optical transmission function with the package substrate structure by incorporating glass core waveguides directly into the substrate. This combines multiple functions (structural support, electrical interconnection, and optical transmission) into a single integrated component, reducing the number of separate parts and simplifying manufacturing processes.
2Quantity of substance
If existing interconnect technologies are used, then electrical connections are established, but interconnect density remains low both vertically and horizontally
Solution Approach 1:
The patent implements three-dimensional stacked architecture with through-silicon vias (TSVs) that enable vertical interconnections between multiple layers. This adds a vertical dimension to interconnect routing, dramatically increasing interconnect density and enabling high-bandwidth communication between stacked PICs and electronic circuits without increasing footprint area.
Solution Approach 2:
The patent uses composite package substrate structures combining organic substrates with embedded glass core waveguides and metal interconnect layers. This composite approach allows simultaneous optimization of electrical conductivity, optical transmission, and mechanical properties to achieve high interconnect density and bandwidth.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances interconnect density, reduces signal losses, and improves manufacturing yield by providing a stable and efficient means for both electrical and optical connections within the PIC package, addressing the limitations of current interconnect technologies.
Implementation Method 1
a second optical component coupled to the core, wherein the second optical component is optically coupled to the PIC by an optical pathway through the first optical component and the core
Data Source
AI summary
Microelectronic assemblies, related devices and methods, are disclosed herein. In some embodiments, a microelectronic assembly may include a substrate having a glass core with a surface and a dielectric material on a portion of the surface of the core, the dielectric material including conductive pathways and an interconnect die; a processor integrated circuit (XPU) and a photonic integrated circuit (PIC), having an active surface facing towards the core, electrically coupled to the interconnect die and to the conductive pathways; a first optical component optically coupled to the active surface of the PIC and to the surface of the core; and a second optical component coupled to the core, wherein the second optical component is optically coupled to the PIC by an optical pathway through the first optical component and the core.