Glass Interposer Photonic Packaging for Optical-Electrical Integration
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing technologies face challenges in efficiently integrating optical and electrical components within devices for signal transmission and processing, particularly in forming compact and functional packages that facilitate conversion between optical and electrical signals.
Innovation Solution
The use of a glass interposer to interconnect a compact universal photonic engine (COUPE) by forming optical components on a silicon-on-insulator substrate, followed by bonding with semiconductor devices using dielectric-to-dielectric and metal-to-metal bonding processes, and incorporating additional layers for electrical connections and optical pathways.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If optical and electrical components are integrated within devices for signal transmission and processing, then device functionality is enhanced, but device complexity increases
Solution Approach 1:
The device is divided into separate optical and electrical component modules that are independently manufactured and then integrated. This segmentation allows each component to be optimized independently while reducing overall integration complexity through standardized interfaces and bonding processes.
2Productivity
If optical components are formed on silicon-on-insulator substrate and bonded with semiconductor devices, then integration efficiency is improved, but manufacturing precision requirements increase
Solution Approach 1:
A glass interposer is introduced as an intermediary substrate between the optical components on silicon-on-insulator and the semiconductor devices. This interposer provides a stable platform with standardized bonding interfaces, facilitating precise alignment and reducing the direct precision requirements between the optical and electrical components.
Solution Approach 2:
The bonding process utilizes controlled parameter changes including temperature variations and pressure application to achieve precise bonding between components. By dynamically adjusting these parameters during the bonding process, high precision alignment and bonding are achieved while maintaining manufacturing efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables efficient integration of optical and electrical components, facilitating seamless signal conversion and transmission, enhancing device functionality and compactness.
Implementation Method 1
Glass interposers may be used to interconnect compact universal photonic engines (COUPEs)
Implementation Method 2
bonding with semiconductor devices using dielectric-to-dielectric and metal-to-metal bonding processes
Data Source
AI summary
Optical devices and methods of manufacture are presented in which glass interposers are incorporated with optical devices. In some embodiments a method includes forming a first optical package and then bonding the first optical package to a first glass interposer. The first glass interposer may then be connected to a second interposer.