All-Glass Stacked Packaging for Stable Fan-Out Interconnects
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Solution Overview
Problem
Existing semiconductor stacked packaging structures face issues with poor connection stability between fan-out package units due to misalignment under external forces.
Innovation Solution
An all-glass stacked packaging structure is prepared by butt-joining an embedded chip fan-out packaging structure with a glass metallized circuit structure and filling the gap with an inorganic silicate or alkali metal-free compound, then sintering to secure the connection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If fan-out package units are stacked and connected via solder balls, then the packaging structure can be formed, but the connection stability deteriorates due to misalignment under external forces
Solution Approach 1:
The patent changes the connection method from solder balls to glass-to-glass direct bonding with sintered connecting material. This parameter change in the bonding mechanism eliminates the misalignment issue by creating a rigid, stable connection that maintains alignment under external forces, thereby improving both connection stability and alignment stability.
Solution Approach 2:
The patent uses a composite structure combining glass substrates with sintered inorganic silicate or alkali metal-free compound connecting material. This composite material system provides both the electrical connection function and the mechanical stability needed to prevent misalignment, resolving the contradiction between connection stability and alignment stability.
2Strength
If glass substrate is used for embedded chip mounting and circuit fabrication, then rigidity and dielectric properties are improved, but manufacturing complexity increases
Solution Approach 1:
The glass substrate serves multiple functions: it provides mechanical support (rigidity), electrical insulation (dielectric properties), and serves as the mounting platform for embedded chips. By making the glass substrate multi-functional, the patent achieves improved strength without proportionally increasing manufacturing complexity, as the same substrate performs multiple roles.
Solution Approach 2:
The patent merges the circuit fabrication process directly onto the glass substrate, combining the substrate function with the circuit board function. This integration reduces the need for separate components and layers, thereby managing manufacturing complexity while achieving the desired rigidity and dielectric properties.
3Reliability
If connecting material is sintered at high temperature for extended time, then connection stability is improved, but energy consumption and processing time increase
Solution Approach 1:
The patent changes the sintering parameters by using inorganic silicate or alkali metal-free compound connecting materials that can achieve stable connections at lower temperatures (100-200°C) and shorter times (0.5-2 hours) compared to traditional high-temperature sintering. This parameter change reduces energy consumption and processing time while maintaining connection stability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method enhances the stability of electrical connections between the embedded chip fan-out packaging structure and the glass metallized circuit structure, resulting in a more stable packaging structure with improved rigidity and dielectric properties.
Implementation Method 1
a metal bump of the embedded chip fan-out packaging structure is butt-joined and secured by welding to a second redistribution layer of the glass metallized circuit structure
Implementation Method 2
sintering is carried out on the connecting material to enable the embedded chip fan-out packaging structure to be fixedly connected to the glass substrate of the glass metallized circuit structure by sintering the connecting material
Data Source
AI summary
The method of preparing an all-glass stacked packaging structure includes the following steps: S1: providing an embedded chip fan-out packaging structure provided with a glass substrate and a glass metallized circuit structure provided with a glass substrate, and butt-joining and securing by welding a metal bump of the embedded chip fan-out packaging structure to a second redistribution layer of the glass metallized circuit structure; and S2: filling a gap between the embedded chip fan-out packaging structure and the glass metallized circuit structure with an inorganic silicate or an alkali metal-free silicon compound, and carrying out sintering to obtain the all-glass stacked packaging structure.