Glass Pillar Capacitor Structure for High-Capacitance Package Substrates
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Solution Overview
Problem
Existing integrated capacitor architectures in electronic packages do not provide sufficient capacitance and are not compatible with advanced glass core package substrates, which is a limitation for fully integrated voltage regulator (FIVR) architectures.
Innovation Solution
The integration of capacitive structures over a scaffolding of pillars or fins on a glass substrate, where the scaffolding can be made of silicon and oxygen with high aspect ratios, and the capacitive structure includes a first conductive layer, a dielectric layer, and a second conductive layer, with the option of using carbon nanotubes as the conductive material, ensuring compatibility with glass core solutions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If discrete capacitors are attached to the package substrate, then capacitance is provided for power delivery, but the device complexity and manufacturing difficulty increase
Solution Approach 1:
The patent combines the capacitor structure with the package substrate by integrating capacitor electrodes and dielectric material directly into the substrate layers. This merging eliminates the need for separate discrete capacitor components and their attachment processes, thereby providing the required capacitance while reducing device complexity and manufacturing difficulty.
Solution Approach 2:
The package substrate is designed to serve multiple functions: it acts as both the structural platform for mounting electronic components and as an integrated capacitor for power delivery. By making the substrate multi-functional, the patent eliminates the need for separate discrete capacitors, thus reducing device complexity while maintaining the required capacitance.
2Device complexity
If existing integrated capacitor architectures are used, then device complexity is reduced, but sufficient capacitance and compatibility with glass core substrates are not achieved
Solution Approach 1:
The patent utilizes the vertical dimension by forming high-aspect-ratio capacitor electrodes that extend through multiple layers of the package substrate. This three-dimensional arrangement of electrodes and dielectric material significantly increases the effective capacitance area without increasing the planar footprint, thereby achieving sufficient capacitance while maintaining low device complexity and ensuring compatibility with glass core substrates.
Solution Approach 2:
The patent employs composite material structures combining conductive materials for electrodes, dielectric materials for insulation, and glass core materials for the substrate. This composite approach enables the integrated capacitor to achieve sufficient capacitance values while maintaining compatibility with advanced glass core package substrates and keeping the overall device complexity low.
3Ease of manufacture
If capacitor structures are integrated into the package substrate manufacture, then device complexity is reduced, but sufficient capacitance and compatibility with glass core substrates are not achieved
Solution Approach 1:
The patent achieves sufficient capacitance within the integrated manufacturing process by utilizing the vertical dimension with high-aspect-ratio electrodes that extend through multiple substrate layers. This approach increases the effective capacitance area without requiring additional manufacturing steps or increasing planar complexity, thereby maintaining ease of manufacture while achieving the required capacitance levels compatible with glass core substrates.
Solution Approach 2:
The patent uses composite material systems including conductive electrode materials, dielectric materials, and glass core materials that can be processed together in the package substrate manufacture. This composite material approach enables the integrated capacitor to achieve sufficient capacitance through standard manufacturing processes, maintaining ease of manufacture while ensuring compatibility with glass core substrates.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach provides enhanced capacitance values and compatibility with glass core substrates, enabling effective power delivery in advanced electronic packaging architectures.
Implementation Method 1
a capacitor over the pillar, wherein the capacitor comprises: a first conductive layer on the pillar; a dielectric layer over the first conductive layer; and a second conductive layer over the dielectric layer
Data Source
AI summary
Embodiments disclosed herein include electronic packages. In an embodiment, the electronic package comprises a substrate, where the substrate comprises glass. In an embodiment, a pillar is over the substrate, and a capacitor is over the pillar. In an embodiment, the capacitor comprises a first conductive layer on the pillar, a dielectric layer over the first conductive layer, and a second conductive layer over the dielectric layer.