Glass Substrate Plating Adhesion via Metal Oxide Layer
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Solution Overview
Problem
Conventional electroless copper plating processes struggle to achieve sufficient deposition and adhesion on glass substrates with excellent smoothness, leading to poor copper plating in printed circuit boards and package substrates, and the copper sputtering process is inefficient for coating through holes and costly for mass production.
Innovation Solution
A method involving forming a metal oxide layer on a glass substrate, followed by heat treatment, electroless copper plating, another heat treatment, and finally electrolytic copper plating, which enhances adhesion and deposition quality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional electroless copper plating process is used on glass substrate, then the process is simple and cost-effective, but the adhesion and deposition quality are insufficient
Solution Approach 1:
The patent applies preliminary surface treatment to the glass substrate before electroless copper plating. Specifically, the glass substrate undergoes surface activation treatment (such as plasma treatment, chemical etching, or application of adhesion promoters) to create a roughened surface or introduce reactive groups that enhance the adhesion of subsequent copper deposit. This preliminary action transforms the smooth, non-adhesive glass surface into a surface that readily bonds with copper, resolving the contradiction between process simplicity and adhesion quality.
Solution Approach 2:
The patent introduces an intermediary layer between the glass substrate and the copper plating. This intermediary layer (which could be a metal oxide layer, adhesion promoter layer, or transition metal layer) serves as a chemical bridge that bonds to both the glass substrate and the copper deposit. The intermediary layer has surface properties that match both materials, enabling strong interfacial bonding and resolving the adhesion problem while maintaining process simplicity through a straightforward multi-layer deposition sequence.
2Manufacturing precision
If copper sputtering process is used to form base film on glass substrate, then adhesion is improved, but the coating of through holes is poor and equipment cost is high
Solution Approach 1:
The patent replaces the mechanical/physical sputtering process with a chemical electroless plating process for forming the base film on glass substrates. Instead of using high-energy particle bombardment (sputtering), the patent employs chemical reduction reactions to deposit copper uniformly. This substitution eliminates the need for expensive sputtering equipment and enables mass production while maintaining good adhesion through proper surface preparation and chemistry control.
Solution Approach 2:
The patent changes the deposition parameters and process conditions to optimize electroless plating performance. By adjusting parameters such as pH, temperature, catalyst concentration, and chemical composition of the plating bath, the patent achieves uniform copper deposition with excellent adhesion on glass substrates. These parameter optimizations enable the electroless process to match or exceed sputtering performance while being suitable for high-volume manufacturing.
3Reliability
If glass substrate with excellent smoothness is used, then dielectric constant and communication performance are improved, but electroless copper plating adhesion becomes difficult
Solution Approach 1:
The patent applies local quality modification to the glass substrate surface. While the bulk glass material maintains its excellent smoothness and dielectric properties for high-frequency communication, the surface layer undergoes localized treatment (such as plasma activation, chemical etching, or coating with adhesion promoters) to create high adhesion sites. This local modification ensures that only the surface layer properties are changed for adhesion purposes, while the bulk material retains its superior electrical and mechanical properties.
Solution Approach 2:
The patent creates a composite structure consisting of the smooth glass substrate combined with a surface treatment layer or adhesion promoter coating. This composite material system combines the beneficial properties of both components: the glass substrate provides excellent dielectric constant and smoothness for high-frequency performance, while the surface treatment layer provides high adhesion for copper plating. The two materials work together synergistically to resolve the contradiction between communication performance and plating adhesion.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method produces a plating deposit with strong adhesion to glass substrates, effectively addressing the limitations of conventional processes by ensuring good adhesion and uniform deposition, including within through holes, while being cost-effective for mass production.
Implementation Method 1
forming a metal oxide layer on a surface of a glass substrate
Implementation Method 2
performing a first heat treatment after the step (1)... performing a second heat treatment after the step (3)
Implementation Method 3
forming an electroless copper plating deposit on the metal oxide layer after the step (2)
Implementation Method 4
forming an electrolytic copper plating deposit on the electroless copper plating deposit after the step (4)
Data Source
AI summary
Provided is a method of producing a plating deposit which enables the production of a plating deposit with good adhesion to a glass substrate. Included is a method of producing a plating deposit, which includes: (1) forming a metal oxide layer on a surface of a glass substrate; (2) performing a first heat treatment after the step (1); (3) forming an electroless copper plating deposit on the metal oxide layer after the step (2); (4) performing a second heat treatment after the step (3); and (5) forming an electrolytic copper plating deposit on the electroless copper plating deposit after the step (4).