Glass Vertical Interconnect Structure for Low-Loss RF 3D ICs
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Solution Overview
Problem
Existing vertical interconnect components for radio frequency signal transmission in three-dimensional integrated circuits are complex, prone to flaws, expensive, occupy large areas, and suffer from high dielectric losses, hindering high-density integration.
Innovation Solution
A vertical interconnect micro-component using a glass substrate with inner and outer through connectors, each filled with solid conductor material, is structured by laser processing and etching, eliminating the need for additional insulation and reducing dielectric losses.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional hole structures with multi-stage material deposition are used for vertical interconnection, then radio frequency signal transmission is achieved, but the structure becomes complex and occupies larger areas
Solution Approach 1:
The patent extracts and eliminates the insulating layer from the vertical interconnect structure, using only the conductor material filled hole structure for both mechanical support and electrical function. This removal of the insulating layer simplifies the multi-stage deposition process while maintaining RF signal transmission capability through the conductor-filled hole design.
Solution Approach 2:
The patent merges the functions of the insulating layer and the structural support into a single conductor-filled hole structure. The hole structure itself provides both the mechanical framework and the electrical interconnection, eliminating the need for separate insulating and conductive layers.
2Reliability
If conventional hole structures with insulating layers are used, then vertical interconnection is achieved, but manufacturing costs increase and errors occur
Solution Approach 1:
The patent removes the insulating layer from the conventional vertical interconnect structure, reducing the number of manufacturing steps from multi-stage material deposition to a simpler conductor filling process. This extraction of the insulating component directly reduces manufacturing complexity and associated costs.
Solution Approach 2:
The patent changes the material parameter by using conductor material (such as copper or gold) that serves dual purposes: providing electrical interconnection and structural support. This parameter change from insulating to conducting material eliminates the need for separate insulating layers and simplifies manufacturing.
3Reliability
If larger hole structures are used for vertical interconnection, then signal transmission is ensured, but integration density decreases
Solution Approach 1:
The patent changes the dimensional parameters of the hole structures, using smaller diameter holes filled with conductor material. The conductor-filled design allows these smaller holes to maintain adequate signal transmission capability while occupying less area, thereby increasing the number of interconnects that can be packed into a given substrate area.
Solution Approach 2:
The patent transitions from a two-dimensional planar interconnect approach to a three-dimensional vertical approach using through-substrate holes. This dimensional change allows signals to transmit vertically through the substrate rather than laterally, enabling higher integration density by utilizing the depth dimension of the substrate.
4Strength
If conventional insulating materials are used in vertical interconnects, then structural support is provided, but dielectric losses increase
Solution Approach 1:
The patent extracts and removes the insulating material from the vertical interconnect structure, eliminating the source of dielectric losses. The conductor-filled hole structure provides structural support without the energy-loss-prone insulating materials that characterize conventional designs.
Solution Approach 2:
The patent uses the substrate material itself (such as ceramic or glass) in combination with the conductor filling to provide both structural support and low-loss electrical performance. This composite approach eliminates the need for separate insulating materials that contribute to dielectric losses.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The glass substrate-based design simplifies manufacturing, reduces structural errors, minimizes dielectric losses, and allows for higher integration density with reduced substrate area, enabling efficient radio frequency signal transmission.
Implementation Method 1
A vertical interconnect micro-component using a glass substrate with inner and outer through connectors, each filled with solid conductor material, is structured by laser processing and etching
Implementation Method 2
A vertical interconnect micro-component using a glass substrate with inner and outer through connectors, each filled with solid conductor material, is structured by laser processing and etching
Data Source
AI summary
A vertical interconnect micro-component adapted for radio frequency signal transmission, preferably for the use in three-dimensional integrated circuits, including: a glass substrate with a first side and a second side opposite to the first side, at least one inner through connector formed in the glass substrate, wherein the inner through connector includes an inner cavity in the glass substrate extending from the first side to the second side of the glass substrate, the inner cavity being fully or partially filled with solid conductor material, and an outer through connector structure formed in the glass substrate and surrounding the at least one inner through connector, the outer through connector structure including one or more outer cavities in the glass substrate extending from the first side to the second side of the glass substrate, the one or more outer cavities each being fully or partially filled with solid conductor material.