Glass Spacer IC Package for DRAM Heat Isolation
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Solution Overview
Problem
Legacy system-in-package (SIP) integrated circuit (IC) packages face heating issues due to the higher operational temperature of application-specific IC (ASIC) dies, which can exceed the maximum operational junction temperature of dynamic random access memory (DRAM) dies, causing the SIP to turn off, as silicon spacers have high thermal conductivity and provide little protection.
Innovation Solution
Incorporating a glass spacer with a low thermal conductivity, composed of three layers including a core layer with glass fibers and epoxy resin, between the ASIC and DRAM dies to reduce heat transfer, and a molding compound that encompasses the dies and spacer to dissipate heat effectively.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a silicon spacer is used between the ASIC die and DRAM die, then the structural support is provided, but the thermal conductivity is too high causing heat transfer to the DRAM die
Solution Approach 1:
The patent changes the material parameter of the spacer from silicon (high thermal conductivity) to glass (low thermal conductivity). This parameter change reduces the thermal conductivity of the spacer, thereby limiting heat transfer from the ASIC die to the DRAM die and preventing the DRAM die junction temperature from exceeding its maximum operational temperature.
Solution Approach 2:
The patent employs a glass spacer as a composite material solution between the ASIC and DRAM dies. The glass material provides both structural support functionality and thermal insulation properties, creating a composite structure that simultaneously addresses mechanical support requirements and thermal management needs.
2Volume of stationary object
If the ASIC die is positioned close to the DRAM die for compact packaging, then the package size is reduced, but heat transfer to the DRAM die increases
Solution Approach 1:
The glass spacer acts as an intermediary element positioned between the ASIC die and DRAM die. It provides thermal insulation while maintaining the compact vertical stacking arrangement, enabling close positioning of dies for small package size while preventing harmful heat transfer through the spacer material.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The glass spacer effectively limits heat transfer between the ASIC and DRAM dies, preventing the DRAM from exceeding its operational threshold temperature, thereby ensuring continuous operation by reducing thermal conductivity and enhancing thermal management.
Implementation Method 1
The glass spacer effectively limits heat transfer between the ASIC and DRAM dies, preventing the DRAM from exceeding its operational threshold temperature, thereby ensuring continuous operation by reducing thermal conductivity
Data Source
AI summary
Apparatuses, systems and methods associated with integrated circuit (IC) package design are disclosed herein. In embodiments, an IC package may include a first die and a second die. The IC package may include a spacer located between the first die and the second die, the spacer includes glass, and a molding compound that at least partially encompasses the first die, the second die, and the spacer. Other embodiments may be described and/or claimed.