Glass Substrate Penetrating Structure Bump Suppression
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Solution Overview
Problem
Glass substrates with penetrating structures often develop bump portions during wet etching, leading to issues in conductive member filling and joining strength, particularly when used in glass interposers or laminates.
Innovation Solution
A method involving laser irradiation, followed by wet etching and polishing with acid-soluble abrasive grains, and subsequent acid cleaning to suppress the formation of bump portions around the penetrating structure openings.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If wet etching is performed to improve the shape of the initial penetrating structure, then the penetrating structure shape is improved, but bump portions are generated around the opening
Solution Approach 1:
The patent changes the chemical composition parameters of the glass substrate by specifying precise ranges of B2O3 (3-30 mol%), SiO2 (65-70 mol%), and other oxides. This compositional parameter change makes the glass more resistant to bump portion formation during wet etching while maintaining etchability for shape improvement.
Solution Approach 2:
The patent applies preliminary action by forming a specific glass composition before the wet etching process. The pre-designed glass composition with controlled B2O3 and SiO2 content prepares the material to resist bump formation during subsequent etching, preventing the problem before it occurs.
2Shape
If a bump portion exists on the surface, then the surface has higher points, but seed layer formation is prevented in those areas
Solution Approach 1:
The patent changes the glass composition parameters (B2O3: 3-30 mol%, SiO2: 65-70 mol%) to control the surface morphology during wet etching. This parameter change ensures the surface remains sufficiently flat for complete seed layer coverage while still allowing the penetrating structure to be formed.
3Shape
If a bump portion is present on the glass substrate surface, then the surface is uneven, but joining strength is reduced and delamination occurs
Solution Approach 1:
The patent specifies precise compositional parameters (B2O3: 3-30 mol%, SiO2: 65-70 mol%, and other oxides in defined ranges) that control the glass's interaction with etching solutions. This parameter optimization maintains surface flatness during penetrating structure formation, ensuring adequate joining strength and preventing delamination.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Significantly reduces bump portions, ensuring proper conductive member filling and enhanced joining strength by maintaining a smooth surface with reduced arithmetic mean roughness, preventing delamination and ensuring effective plating and bonding.
Implementation Method 1
having the glass substrate irradiated with a laser from a first surface side, to form an initial penetrating structure
Implementation Method 2
cleaning the glass substrate with an acid solution
Data Source
AI summary
A method of manufacturing a glass substrate having a penetrating structure, the method includes: (1) preparing a glass substrate that has a first surface and a second surface opposite to each other, and includes 3 mol % to 30 mol % of B2O3 in terms of oxide; (2) having the glass substrate irradiated with a laser from a first surface side, to form an initial penetrating structure; (3) wet etching the glass substrate having the initial penetrating structure formed; (4) polishing the wet-etched glass substrate from the first surface side, by using an abrasive including acid-soluble abrasive grains; and (5) cleaning the glass substrate with an acid solution.