Lapping Machines TRIZ Cases
- Soft Retaining Ring for Uniform CMP Wafer Polishing
A retaining ring with controlled hardness prevents polishing pad distortion while ensuring uniform wafer thickness profiles.
- Semiconductor Wafer Flatness Control via Hard Polishing Pad
A semiconductor wafer with controlled outer peripheral sag utilizes high-hardness polishing pads to minimize surface deviations.
- Polishing Endpoint Detection via Torque Current Difference
The system determines the polishing endpoint by comparing accumulated torque current against real-time measurements, resolving noise interference that masks small signal changes.
- Orbital Polishing with Small Pad for Uniformity
A polishing pad undergoes orbital motion while maintaining a fixed angular orientation relative to the substrate.
- Dynamic Residue Clearing Control with In-Situ Profile Monitoring
In-situ profile control calculates dynamic polishing recipes to resolve endpoint inconsistencies caused by substrate thickness variations.
- Phase-Change Lapping Carrier for HDD Slider Bars
A lapping carrier uses a phase-change mounting structure to adapt rigidity during slider bar processing.
- Top Ring Retainer Guiding Device for Quadrangular Substrate Processing
A top ring retainer guiding device constrains horizontal displacement while permitting vertical movement of the holding component.
- Adaptive Spectral Feature Tracking for CMP Endpoint Detection
A spectral feature tracking method measures substrate thickness to calculate a dynamic target value for endpoint detection.
- CMP Polishing Pad Conditioner Torque Monitoring
CMP polishing pad conditioner monitors rotational force metrics during pre-polish to adjust recipes, resolving variability in consumable interaction.
- Magnetic Retaining Ring for CMP Edge Uniformity
Movable teeth in a magnetic retaining ring adjust the gap to the polishing pad, reducing edge effects and slurry consumption by optimizing fluid flow.
- Polishing Pad Embedded Sensors Wireless Data Transmission
Embedded sensors and memory in a polishing pad transmit process data via non-contact communication units.
- CMP System with Self-Refreshing Grinding Head
A chemical mechanical polishing system uses independently rotating grinding pieces to refresh the pad surface.
- Light-Reactive Polishing Pad Rigidity Control
A polishing pad incorporates light reactive material to adjust rigidity through optical irradiation.
- Non-Planar CVD Diamond CMP Pad Conditioner
CVD diamond coated composite substrate maintains high removal rates while extending pad life.