Polishing Pad Embedded Sensors Wireless Data Transmission
Solution Overview
Problem
Conventional CMP polishing processes are unstable due to changing conditions like temperature and pressure, requiring complex apparatus structures and additional sensors for monitoring, which complicates the system and hinders reproducibility.
Innovation Solution
A polishing pad equipped with sensors, a memory, and a non-contact communication unit that detects and stores process conditions, allowing real-time data transmission and storage of operational requirements, enabling adjustments without adding complexity to the polishing apparatus.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If temperature sensors are embedded in the polishing pad to detect wafer temperature, then temperature monitoring capability is improved, but apparatus structure becomes complicated due to additional slip rings
Solution Approach 1:
The patent replaces the mechanical slip ring system with a non-contact communication system using electromagnetic fields. The polishing pad includes a communication unit that transmits detection signals wirelessly to the control unit, eliminating the need for physical contact components like slip rings while maintaining temperature monitoring capability.
Solution Approach 2:
The patent introduces a non-contact communication unit as an intermediary between the temperature sensors embedded in the polishing pad and the control unit. This communication unit transmits detection signals through electromagnetic fields, serving as a mediator that eliminates the need for direct physical connections.
2Reliability
If dedicated detectors are added to the polishing apparatus to monitor polishing conditions, then monitoring capability is improved, but apparatus structure becomes complicated
Solution Approach 1:
The polishing pad is designed to perform multiple functions: it provides the polishing surface, contains embedded temperature sensors, and includes a communication unit for wireless data transmission. This multi-functional design eliminates the need for separate dedicated detectors while maintaining monitoring capability.
Solution Approach 2:
The polishing pad itself serves as the monitoring device by embedding sensors within its structure. The pad automatically detects temperature conditions during polishing and transmits this information wirelessly, making the monitoring system self-contained rather than requiring external dedicated detectors.
3Loss of information
If multiple information sources are accessed to obtain operational requirements data, then data completeness is improved, but information retrieval time increases
Solution Approach 1:
The patent combines multiple information sources into a single integrated system. The control unit accesses detection signals from sensors, operational requirements from a database, and polishing information from the polishing pad's memory through a unified non-contact communication interface, eliminating the need to separately access multiple independent systems.
Solution Approach 2:
The polishing pad's memory unit pre-stores polishing information including detection signals and operational data before the polishing process begins. This preliminary preparation allows the control unit to retrieve all necessary information quickly during operation without needing to query multiple external sources in real-time.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution allows for real-time monitoring and adjustment of polishing conditions, ensuring improved reproducibility and simplifying the management of operational requirements, facilitating analyses and reducing the complexity of the polishing apparatus.
Implementation Method 1
a communication unit for communicating with outside in a non-contact manner
Data Source
AI summary
A polishing pad has structural parts embedded therein; sensors, a memory for storing detected information obtained by the sensors, and a communication unit driven by a power supply unit to communicate with outside in a non-contact manner. The polishing pad and a communication unit configured to communicate with the communication unit of the polishing pad in a non-contact manner constitute a polishing information management system. The polishing pad and a communication unit configured to transmit and receive the information to and from the communication unit of the polishing pad in a non-contact manner constitute a polishing apparatus.