Glass Substrate Capacitor Layout for High-Frequency Signal Integrity
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing glass substrate technologies face challenges in forming capacitors without a capacitor embedding process, which hinders the improvement of signal integrity and power integrity, especially in high-frequency applications.
Innovation Solution
A glass substrate structure with conductive through-vias and capacitor members, featuring overlapping conductive electrodes and slits filled with metal material, allows for direct formation of capacitors without embedding, enhancing signal and power integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a capacitor embedding process is used to form capacitors on glass substrate, then capacitor formation is achieved, but the process complexity increases and manufacturing difficulty worsens
Solution Approach 1:
The invention extracts the capacitor formation from the complex embedding process and simplifies it by directly forming capacitor electrodes on the glass substrate surface. The capacitor is created by depositing conductive patterns that overlap in different layers, eliminating the need for traditional embedding techniques and reducing process complexity while maintaining capacitor formation capability.
Solution Approach 2:
The invention utilizes the vertical dimension by forming capacitor electrodes in multiple layers at different heights on the glass substrate. The first and second capacitor electrodes are positioned at different vertical levels, creating capacitance through their overlapping areas. This dimensional approach simplifies the formation process compared to traditional embedding methods.
2Reliability
If traditional substrate materials are used, then manufacturing is simpler, but signal integrity and power integrity performance deteriorate in high-frequency applications
Solution Approach 1:
The invention changes the substrate material parameter from traditional organic substrates to glass substrate. Glass material provides superior high-frequency properties, better signal integrity, and improved power integrity performance. Although glass substrate processing requires specific techniques, the performance benefits in high-frequency applications justify the manufacturing considerations.
3Ease of manufacture
If capacitor embedding process is avoided, then manufacturing simplicity improves, but capacitor formation capability worsens
Solution Approach 1:
The glass substrate itself serves as the dielectric medium for capacitor formation. The capacitor electrodes are directly formed on the glass substrate surface, and the substrate's inherent properties provide the necessary electrical characteristics. This self-service approach eliminates the need for separate embedding processes while ensuring reliable capacitor functionality.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This structure enables easy formation of capacitors with various capacitances, improving signal and power integrity, and can be applied to package substrates and interposers for enhanced performance in electronic devices.
Implementation Method 1
a metal material disposed in at least a portion of each of the plurality of first and second slits
Data Source
AI summary
A glass layer having a first surface and a second surface opposing each other in a first direction; a plurality of conductive through-vias penetrating at least a portion of the glass layer between the first surface and the second surface; and a capacitor member including a plurality of conductive electrodes each penetrating at least a portion of the glass layer between the first surface and the second surface. At least a portion of the plurality of conductive electrodes has regions overlapping each other in a second direction perpendicular to the first direction.