Glass Substrate Etching Apparatus with Dynamic Circulating Unit
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Solution Overview
Problem
Existing etching methods for glass substrates in flat panel displays often result in non-uniformity, leading to image quality defects and increased weight, as they fail to efficiently reduce the thickness of glass substrates uniformly.
Innovation Solution
An etching apparatus with a vessel containing an etchant, a first plate for the glass substrate, and a circulating unit that creates a controlled flow of etchant using adjustable plates and blades, along with sensors and control units to monitor and adjust the etching process, ensuring uniform thickness reduction.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Weight of moving object
If conventional etching methods are used to reduce glass substrate thickness, then weight reduction is achieved, but uniformity is lost leading to image quality defects
Solution Approach 1:
The patent implements a circulating unit with adjustable plates and blades that create dynamic, controlled flow of etchant across the glass substrate surface. The driving unit adjusts the distance between plates and rotation velocity of blades in real-time, transforming the static etching process into a dynamic one that maintains uniform etchant distribution throughout the substrate, thereby achieving both weight reduction and uniformity preservation
Solution Approach 2:
The patent changes the flow parameters of the etchant by using a circulating unit with adjustable plates and blades. The driving unit modifies physical parameters such as the distance between plates and rotation velocity to control etchant flow rate and distribution. This parameter control ensures uniform etching across the substrate while achieving the desired thickness reduction for weight loss
2Length of moving object
If etching is performed to reduce glass substrate thickness for lighter displays, then weight is reduced, but etching uniformity deteriorates
Solution Approach 1:
The circulating unit with adjustable plates and blades creates dynamic flow patterns that adapt during the etching process. The driving unit continuously adjusts operational parameters to maintain uniform etchant circulation, ensuring consistent material removal across the substrate thickness while preventing localized over-etching or under-etching
Solution Approach 2:
The patent incorporates a sensor that measures glass substrate thickness in real-time and provides feedback to the control unit. The control unit processes this information and adjusts the driving unit's operation accordingly, modifying plate distance and blade rotation velocity to maintain uniform etching. This closed-loop feedback system ensures precise thickness control and uniformity throughout the etching process
3Ease of manufacture
If conventional etching methods are used, then glass substrate can be etched, but manufacturing efficiency is low due to non-uniform results requiring rework
Solution Approach 1:
The dynamic circulating unit with adjustable plates and blades optimizes the etching process from the outset, creating uniform flow patterns that prevent defects before they occur. This eliminates the need for rework and inspection iterations, streamlining the manufacturing process and improving overall productivity while maintaining ease of manufacture
Solution Approach 2:
The real-time thickness measurement and feedback control system allows for immediate adjustments during etching, preventing uniformity deviations that would require rework. This proactive control approach improves manufacturing efficiency by ensuring first-pass quality and reducing waste, while the process remains feasible and easy to operate
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus achieves uniform and efficient etching of glass substrates, reducing their thickness significantly, thereby reducing the weight and enabling the production of lighter, slimmer displays with improved flexibility.
Implementation Method 1
a circulating unit in the vessel facing the first plate and configured to create a flow of the etchant on a side of the first plate
Implementation Method 2
a sensor on a sidewall of the vessel and adjacent to the first plate and configured to measure a thickness of the glass substrate
Implementation Method 3
a vessel configured to contain an etchant; a first plate in the vessel and configured to receive a horizontally placed glass substrate thereon
Data Source
AI summary
An apparatus for etching a glass substrate includes a vessel configured to contain an etchant; a first plate in the vessel and configured to receive a horizontally placed glass substrate thereon; and a circulating unit in the vessel facing the first plate and configured to create a flow of the etchant on a side of the first plate.