Glass Substrate Etching for Minute Pattern Precision
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Solution Overview
Problem
The existing printing methods for forming patterns on substrates, particularly for semiconductor and LCD devices, face challenges in achieving minute patterns due to physical contact issues and limitations in forming precise patterns with organic materials, leading to reduced productivity and accuracy.
Innovation Solution
The method involves using a glass substrate with etched grooves, where a metal layer is patterned and used as a mask for dry- or wet-etching to create a predetermined pattern on the glass substrate, allowing for precise control over the etching depth and enabling the formation of minute patterns without relying on organic materials.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If organic material is used for pattern formation on printing plate, then the printing process can be simplified, but the pattern precision and completeness are insufficient
Solution Approach 1:
The invention changes the material parameter from organic material to inorganic glass substrate, and changes the pattern formation mechanism from coating to etching. This parameter change enables precise pattern formation while maintaining manufacturing simplicity, as the glass substrate can be etched to exact depths with clean edges using standard etching processes.
Solution Approach 2:
The invention replaces the mechanical coating process with a chemical etching process. Instead of depositing organic material layers that require alignment and curing, the glass substrate is directly etched using chemical reactions, providing better pattern definition and eliminating the limitations of organic material deposition.
2Manufacturing precision
If multiple layers are deposited using CVD and sputtering followed by photolithography, then the desired pattern can be formed, but the productivity is lowered
Solution Approach 1:
The invention merges multiple separate processes (material deposition, photolithography, and etching) into a single etching step. By pre-forming the pattern directly on the glass substrate through etching, the need for separate deposition and photolithography steps is eliminated, significantly reducing process complexity and improving productivity.
Solution Approach 2:
The invention performs the pattern formation action preliminarily by etching the glass substrate before the printing material is applied. This preliminary patterning of the substrate eliminates the need for subsequent photolithography steps, as the pattern is already established in the substrate itself.
3Ease of operation
If physical contact is generated between substrate and printing roll, then the printing material can be transferred, but various problems occur with substrate and printing roll
Solution Approach 1:
The invention introduces a coating layer as an intermediary between the printing material and the printing roll. This coating layer, formed by etching the glass substrate, serves as a mediator that enables material transfer while protecting both the substrate and the roll from direct physical contact, thereby preventing damage and improving reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for the formation of precise, minute patterns on the glass substrate, enhancing the accuracy and productivity of the printing process, particularly for semiconductor and LCD device fabrication, by controlling the etching depth and reducing the complexity of the deposition and etching processes.
Implementation Method 1
etching the glass substrate to a predetermined depth using the patterned metal layer as a mask
Data Source
AI summary
A printing plate and method for fabricating the same is disclosed. A metal layer is first formed on a glass substrate. The metal layer is then patterned in a predetermined shape. The glass substrate is next etched to a predetermined depth using the patterned metal layer as a mask and the metal layer removed. If necessary, additional metal layers have the same or different patterns may be formed on the glass substrate and the glass substrate etched after each metal layer is formed thereon until a desired etching depth in the glass is achieved.