A substrate patterning method widens openings into spaced pillars that serve as etch masks for sub-lithographic features.
A transfer sheet uses a thermoplastic resin binder in its uneven layer to bond the release layer and prevent defective transfers.
Segmented upper yoke film prevents neck height induced track width extension, maintaining overwrite characteristics.
A suspended membrane structure uses a patterned dielectric layer to connect lower electrodes through conductive vias for capacitive detection.
A block copolymer layer undergoes microphase separation to form precise patterns on a neutral guide layer.
A MEMS base surface processing method applies a protective film to prevent unintended etching of non-ground regions during wet-etching.
Inkjet nozzles dispense precursor drops to form user-defined polymer films, eliminating vacuum processing costs and material wastage.
A pattern forming method uses block copolymer self-assembly to generate precise sub-10nm structures on semiconductor substrates.
Segmenting deposition from mechanical embossing controls aesthetic appearance and conductivity while maintaining electromagnetic signal transmissivity.
A decorative sheet uses a low hydroxyl value primer layer to achieve vivid raven blackness.
A conductive mask layer replaces dielectric materials in semiconductor fabrication to form precise openings.