MEMS Base Surface Processing with Protective Film
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Solution Overview
Problem
Existing base surface processing methods for MEMS devices cause unintended etching of non-ground regions during wet-etching, leading to reduced rigidity and potential breakage of the base when moved.
Innovation Solution
A base surface processing method involving the formation of a protective film along the outer edge of the base surface using vapor deposition or thermal oxidation, followed by grinding the processing surface and selective etching to remove grinding residues while maintaining the shape of the outer edge.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If wet-etching is performed to smooth the ground processing surface, then grinding residues are removed and the surface is smoothed, but the base in non-ground regions is also etched, reducing rigidity and causing breakage
Solution Approach 1:
The patent applies a protective film selectively to specific regions (non-ground regions, peripheral portions, or entire surface) of the base surface. This creates local differentiation where some areas are protected from etching while the processing surface remains exposed for smoothing. The protective film is formed through vapor deposition or thermal oxidation methods, enabling precise spatial control of the etching process.
Solution Approach 2:
The protective film is formed on the base surface before the wet-etching process. This preliminary protective action prevents unintended etching of non-ground regions during the subsequent smoothing operation. The protective film serves as a pre-applied barrier that maintains structural integrity before the actual surface smoothing occurs.
2Volume of moving object
If the base is thinned by grinding to achieve desired thickness, then the base is reduced to suitable thickness for device formation, but grinding scraps and residues are formed on the processing surface
Solution Approach 1:
The patent converts the harmful effect of wet-etching (which removes material) into a beneficial process by using it specifically to remove grinding residues and smooth the processing surface. The protective film prevents this harmful etching effect from affecting non-ground regions, thereby transforming a potentially damaging process into a useful cleaning and smoothing operation.
Solution Approach 2:
The patent changes the physical and chemical state of the base surface through controlled wet-etching. The etching process dissolves and removes grinding residues by changing the material state from solid residue to dissolved particles in the etchant solution, thereby cleaning the surface while the protective film prevents unwanted material removal.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Prevents etching of non-ground regions, maintains the shape and rigidity of the base surface, and suppresses damage and breakage during movement by reinforcing the base with the protective film.
Implementation Method 1
forming a protective film along at least an outer edge of the first base surface
Implementation Method 2
forming a protective film along at least an outer edge of the first base surface
Implementation Method 3
thinning the base by grinding the processing surface
Implementation Method 4
smoothing by etching the processing surface ground by the thinning
Data Source
AI summary
A base surface processing method includes forming a protective film on a base surface; thinning a part of a base by grinding a part of the base surface; and etching a ground surface ground by the thinning.