Glass Substrate PCB Warpage Prevention
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Solution Overview
Problem
Conventional PCB boards experience warpage due to the large expansion and contraction coefficients of organic resin insulating layers, leading to deformation and peeling of conductive layers, which affects performance and requires additional heat dissipation structures, increasing costs.
Innovation Solution
A manufacturing method using a glass substrate with a silver paste wiring layer and non-transparent ink material layers, where the glass substrate's low expansion coefficient minimizes deformation and eliminates the need for additional heat dissipation structures, while the silver paste wiring ensures conductivity without using insulating resin.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If organic resin is used as the insulating layer, then the PCB board can be manufactured with conventional materials, but the large expansion and contraction coefficient causes warpage and deformation
Solution Approach 1:
The patent changes the material parameter from organic resin to glass fiber, which has a significantly lower thermal expansion coefficient. This parameter change resolves the warpage issue while maintaining manufacturability through conventional PCB manufacturing processes.
Solution Approach 2:
The patent uses a composite structure combining glass fiber (insulating layer) with aluminum substrate and copper foil conductive layers. This composite material approach maintains electrical insulation properties while improving dimensional stability.
2Device complexity
If organic resin is used as the insulating layer, then the PCB board structure is simple, but the conductive layer peels off due to deformation
Solution Approach 1:
Changing the insulating layer material from organic resin to glass fiber fundamentally alters the thermal expansion parameter, preventing the deformation that causes conductive layer peeling and improving reliability.
3Temperature
If additional heat dissipation structures are added, then heat dissipation performance is improved, but manufacturing costs increase
Solution Approach 1:
The glass fiber insulating layer serves dual functions: electrical insulation and heat dissipation. This multi-functionality eliminates the need for separate heat dissipation structures, reducing manufacturing costs while maintaining thermal management performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method improves the performance and stability of PCB boards by preventing warpage and conductive layer peeling, reducing manufacturing costs through effective heat dissipation and enhanced electromagnetic compatibility.
Implementation Method 1
heating the glass substrate layer such that the glass substrate layer is uniformly heated to a preset temperature
Implementation Method 2
cooling the heated glass substrate layer by adopting a preset cooling manner, to temper and fuse the non-transparent ink material layer and the silver paste wiring with the glass substrate layer
Implementation Method 3
prior to the coating the non-transparent ink material layer on the bottom surface of the glass substrate layer, further including: sintering the silver paste wiring
Implementation Method 4
curing processing the white reflective ink material layer
Data Source
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AI summary
The present disclosure provides a PCB board (110), a manufacturing method of a PCB board (110), and an electrical device (100), where the PCB board (110) includes an insulating dielectric layer (10) which is a glass substrate layer (10) including a top surface and a bottom surface disposed oppositely; a conductive wiring layer (20) which is disposed on a top surface of the insulating dielectric layer; and a top ink layer (30) which is coated on the conductive wiring layer (20). According to the technical solution provided by the embodiment of the disclosure, the PCB board (20) does not generate the phenomenon of deformation warping, and the conductive wiring layer (20) is not easily peeled off from the insulating medium layer (10), and the use performance of the PCB board (110) is good.