Glass Substrate With Resin Layer And Through-Glass Via
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Solution Overview
Problem
Glass substrates with through holes have low mechanical strength and are difficult to handle during processing.
Innovation Solution
A method involving forming through holes in a glass sheet, applying a light-sensitive resin layer, and photoexposing it to prevent exposure from the opposite surface, followed by etching to create through-resin holes, which enhances mechanical strength and handling ease.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If through holes are formed in a glass substrate, then cost is reduced by using glass instead of silicon, but mechanical strength decreases and handling becomes difficult
Solution Approach 1:
A resin layer is formed in advance to cover the through holes before subsequent processing steps. This preliminary action prevents contamination and maintains structural integrity during manufacturing, resolving the contradiction between cost reduction through hole formation and maintaining mechanical strength
Solution Approach 2:
The invention uses a composite structure combining glass substrate with resin material. The resin layer fills and reinforces the areas around through holes, creating a composite material system that maintains mechanical strength while allowing the through holes needed for cost-effective glass substrate manufacturing
2Ease of manufacture
If light is applied from the second principal surface to photoexpose the resin layer, then through-resin holes can be formed, but the glass sheet may protect the resin layer from light exposure
Solution Approach 1:
The invention selects specific wavelength parameters for light exposure (120-300 nm range) where the glass substrate has controlled transmittance characteristics. By changing the wavelength parameter, the resin layer can be effectively photoexposed through the glass sheet while maintaining reliable pattern formation in the through-resin holes
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method results in a glass substrate with improved mechanical strength, making it easier to handle during processing and potentially reducing production costs by eliminating the need for photosensitive glass.
Implementation Method 1
The glass sheet has a light transmittance of 1% or less at the wavelength λ1 and protects the resin layer from the light U
Implementation Method 2
irradiating an area of the glass sheet with a laser beam to form a modified portion in the area irradiated with the laser beam
Implementation Method 3
forming the through hole in the glass sheet by etching at least the modified portion using an etchant that etches the modified portion at an etching rate higher than an etching rate at which the etchant etches an area of the glass sheet where the modified portion is not formed
Implementation Method 4
photoexposing an area of the resin layer that covers the through hole by irradiating the area with light U having the wavelength λ1
Data Source
AI summary
A method for producing a glass substrate according to the present invention includes the steps of: (I) forming a through hole (11) in a glass sheet (10); (II) forming a resin layer (20) on a first principal surface of the glass sheet (10) using a resin composition sensitive to light having a predetermined wavelength λ1; (III) photoexposing an area of the resin layer (20) that covers the through hole (11) by irradiating the area with light U having the wavelength λ1 and applied from the direction of a second principal surface of the glass sheet (10); and (IV) forming a through-resin hole (21) by removing the area photoexposed in the step (III). The glass sheet (10) protects the resin layer (20) from the light U so as to prevent the resin layer (20) from being photoexposed by beams of the light U that are incident on the second principal surface of the glass sheet (10) in the step (III).