Glass Substrate Surface Processing for Static Electrification Control
Solution Overview
Problem
The existing methods for manufacturing glass substrates for flat panel displays fail to effectively suppress static electrification, leading to peeling electrification and potential breakage of the glass substrate and semiconductor elements during film forming processing, due to uneven distribution of protruded portions on the surface.
Innovation Solution
A method for manufacturing glass substrates with dispersed protruded portions on the surface, where the protruded portion area ratio is between 0.5% to 10% and the content ratio is 80% or more, ensuring uniform distribution and reduced contact area with the mounting table, thereby minimizing static electrification.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If the surface of the glass substrate is roughened to suppress electrification, then the area of contact between the glass substrate and the mounting table is reduced, but the distribution of protruded portions becomes uneven, leading to localized regions where electrification is not sufficiently suppressed
Solution Approach 1:
The patent specifies precise parameter ranges for the protruded portions: height of 0.1 μm to 10 μm, and protruded portion area ratio of 1% to 50%. By controlling these parameters, the invention achieves effective electrification suppression while ensuring uniform distribution across the glass substrate surface, preventing localized contact regions.
2Object-affected harmful factors
If the protruded portions are concentrated in certain regions to maximize contact area reduction, then electrification is suppressed in those regions, but regions with few protruded portions experience increased electrification and potential breakage
Solution Approach 1:
The patent ensures that protruded portions are distributed across the entire glass substrate surface with a controlled area ratio of 1% to 50%. This creates uniform local quality throughout the substrate, preventing concentrated stress points and ensuring consistent electrification suppression across all regions, thereby maintaining overall substrate strength and reliability.
3Object-affected harmful factors
If the glass substrate is removed from the susceptor with excessive force due to static electricity adhesion, then the glass substrate or semiconductor elements may break, but applying less force may not overcome the static adhesion
Solution Approach 1:
The patent applies preliminary action by forming protruded portions on the glass substrate surface before the film forming process. This pre-structured surface topology proactively reduces static electricity accumulation and adhesion to the susceptor, enabling easy substrate removal without excessive force and preventing breakage of the glass substrate or semiconductor elements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method effectively suppresses static electrification, preventing breakage of the glass substrate and semiconductor elements, and reducing the attachment of foreign matter, ensuring improved quality and reliability in the manufacturing process.
Implementation Method 1
static electricity due to friction, that is, peeling electrification occurs between the metal surface of the susceptor on which the glass substrate has been mounted and the surface of the glass substrate, and static electricity accumulates in the glass substrate
Data Source
AI summary
A method for manufacturing a glass substrate comprises a surface processing step of performing surface processing for forming unevenness on a glass surface. In the surface processing step, protruded portions having a height of 1nm or more from an average line of a roughness curve are dispersedly formed on the glass surface. In the surface processing step, the surface processing is performed such that a protruded portion area ratio is 0.5 to 10%. The protruded portion area ratio is a ratio of an area of the protruded portions with respect to an area of any rectangular region. The rectangular region has a square shape with a side length of 1 μm. In the surface processing step, in a case where the rectangular region is equally divided into at least one hundred divided regions having a square shape, the surface processing is performed such that a protruded portion content ratio is 80% or more. The protruded portion content ratio is a ratio of the number of divided regions having the protruded portions with respect to the number of divided regions included in the rectangular region.