Glass Wafer Manufacturing for AR Waveguides

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Solution Overview

Problem

Current optical waveguides in augmented reality devices suffer from low visual quality due to issues like low contrast and blurred images, primarily attributed to inadequate control over the angles of total inner reflections within the glass wafers.

Innovation Solution

A method for manufacturing high-quality glass wafers involves edge-grinding, lapping, rough polishing, and fine polishing to achieve flat and smooth main surfaces, ensuring that total inner reflections occur under consistent angles, maintaining the parallelism of light beams and thus enhancing visual quality.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If conventional manufacturing methods are used for optical waveguides, then production is simpler and faster, but visual quality is low with blurred images and low contrast

Engineering Contradiction:
Improvevisual qualityVSAvoidmanufacturing process complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The manufacturing process is divided into multiple sequential stages: edge-grinding, lapping, rough polishing, and fine polishing. Each stage addresses specific surface characteristics and progressively improves precision, allowing complex high-precision manufacturing to be broken down into manageable steps that can be systematically controlled and optimized.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Edge-grinding and lapping are performed as preliminary actions before polishing to pre-condition the glass wafer surfaces. These preliminary steps remove irregularities and prepare the surface for subsequent polishing operations, ensuring that the final polishing stage can achieve the required visual quality more efficiently.

Inventive Principle:
Principle #10Preliminary action

2Manufacturing precision

If multiple polishing steps are performed, then surface flatness and smoothness improve, but manufacturing time and complexity increase

Engineering Contradiction:
Improvesurface flatness and smoothnessVSAvoidmanufacturing efficiency
Core Design Contradiction:
Manufacturing precisionVSProductivity

Solution Approach 1:

The manufacturing process implements continuous useful action through sequential polishing stages where each stage builds upon the previous one. Rough polishing removes material to establish basic flatness, followed by fine polishing that progressively refines the surface. This continuous progression ensures that each step contributes directly to the final surface quality without unnecessary interruptions or redundant operations.

Inventive Principle:
Principle #20Continuity of useful action

Solution Approach 2:

The polishing process utilizes parameter changes by progressively modifying polishing conditions between stages. Rough polishing employs coarser abrasives and higher material removal rates, while fine polishing uses finer abrasives with controlled removal rates. This systematic parameter adjustment allows the process to achieve high surface quality while optimizing the time investment at each stage.

Inventive Principle:
Principle #35Parameter changes

3Reliability

If light beams undergo multiple total inner reflections, then light is transmitted through the waveguide, but angles of reflection vary causing beam parallelism loss and image blur

Engineering Contradiction:
Improvelight transmissionVSAvoidbeam parallelism
Core Design Contradiction:
ReliabilityVSManufacturing precision

Solution Approach 1:

The glass wafer is manufactured with locally optimized surface properties, particularly at the entry and exit faces where light couples in and out. The precise control of surface flatness and parallelism in these critical regions ensures that light beams maintain consistent reflection angles throughout the waveguide, preserving beam parallelism even after multiple total inner reflections.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The patent replaces mechanical alignment adjustments with precision manufacturing. Instead of relying on mechanical positioning or adjustable components to maintain beam parallelism, the solution embeds the required geometric precision directly into the glass wafer structure through controlled polishing processes, creating a passive optical system that maintains beam quality through its inherent geometric properties.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The method produces glass wafers that significantly improve the visual quality of computer-generated information in augmented reality devices by maintaining the parallelism of light beams, resulting in sharper and more coherent visual information.

Implementation Method 1

the light propagates within the light guide plate along a propagation path extending in a main propagation direction from the one position to another position in that the respective light beam experiences a plurality of total inner reflections at the main surfaces of the light guide plate

Methodology Applied
Scientific EffectTotal internal reflection: Total Internal Reflection

Data Source

PatentUS20230415294A1Method for manufacturing a glass wafer of high quality, glass wafer, glass part element, stack, augmented reality device and use
Publication Date: 2023.12.28 SCHOTT GLASS TECH (SUZHOU) CO LTD
  • US20230415294A1 patent drawing
  • US20230415294A1 patent drawing
  • US20230415294A1 patent drawing

AI summary

A method for manufacturing a glass wafer for augmented reality applications includes the steps of: providing the raw wafer; edge-grinding of the raw wafer; lapping the raw wafer; rough polishing the raw wafer; fine polishing the raw wafer to obtain an intermediate wafer; gluing the intermediate wafer on a flat carrier; performing single-side polishing of a first main side of the intermediate wafer; and performing single-side polishing of a second main side of the intermediate wafer.