In-Situ Gradient Alloy Sputter Deposition
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional thin film manufacturing techniques, such as sputter deposition, are limited in producing alloy films with vertically variable and flexible compositions, which are essential for enhancing material properties like abrasion resistance and electronic functionality.
Innovation Solution
A sputter chamber system that uses a flexible composition sputter target with in-situ coverage of secondary materials, allowing the sputter gas to interact with the changing target composition, producing a plasma alloy that condenses on an anode surface to form an alloy film with a vertical gradient.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If conventional sputter deposition is used to deposit alloy films, then a uniform composition film is obtained, but the ability to achieve vertically variable and flexible composition is lost
Solution Approach 1:
The patent applies dynamics by making the target composition changeable during the sputtering process. A first material is sputtered to form an initial layer, then a second material is introduced to modify the target surface composition dynamically. This allows the alloy composition to vary vertically through the film thickness, achieving adaptable composition profiles that conventional static sputtering cannot produce.
Solution Approach 2:
The patent uses preliminary action by first depositing a layer of first material onto the substrate before introducing the second material. This preliminary deposition establishes a foundation that enables subsequent composition modulation, allowing precise control over the vertical composition gradient by managing the sequence and timing of material introduction.
2Adaptability or versatility
If a single material target is used for sputtering, then the manufacturing process is simple, but the ability to produce vertically variable alloy composition is limited
Solution Approach 1:
The patent merges two separate materials (first material and second material) into a single sputtering process. The second material is introduced to the target surface during sputtering, combining with the first material to form an alloy film with vertically variable composition. This merging approach achieves composition flexibility without requiring complex multi-layer targets or separate deposition chambers.
Solution Approach 2:
The sputtering system is designed with multi-functionality to handle both single-material and alloy deposition. The same sputtering apparatus can deposit uniform films using a single material or produce vertically variable alloy compositions by introducing a second material, making the device versatile for different manufacturing requirements without additional complexity.
3Manufacturing precision
If sputter gas interacts with a static target composition, then a consistent alloy film is produced, but vertically variable composition cannot be achieved
Solution Approach 1:
The patent applies parameter changes by modifying the target composition parameter during the sputtering process. The second material is introduced to change the effective composition of the target surface, which alters the sputtering rate and the resulting alloy composition in the deposited film. This dynamic parameter change enables precise control over the vertical composition gradient.
Solution Approach 2:
The process incorporates feedback mechanisms to monitor and control the alloy composition during deposition. By tracking the composition changes and adjusting the introduction rate of the second material accordingly, the system maintains precise control over the vertical composition profile, ensuring manufacturing precision while managing process complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the optimization of alloy film deposition, achieving a flexible and vertically variable composition that enhances mechanical and electronic properties by dynamically modifying the target surface coverage during the sputtering process.
Implementation Method 1
Sputter deposition typically takes place in a vacuum using a sputter gas, such as Argon. Sputtered atoms ejected into the gas phase are not in their thermodynamic equilibrium state, and tend to deposit on all surfaces of the vacuum chamber.
Implementation Method 2
The interaction discharges a plasma alloy which condenses on an anode surface in the chamber. The condensed alloy produces an alloy film.
Implementation Method 3
Sputtering takes place with argon gas plasma, or another inert gas in a plasma state, as well as a target material
Data Source
AI summary
Embodiments relate to a sputter chamber comprising both a target surface and an anode surface. The sputter chamber has both an ingress and an egress to allow passage of a gas. The sputter chamber further includes a target substrate. A secondary material flexibly changes the composition of the target substrate in-situ by changing coverage of the target by the secondary material. Gas entering the sputter chamber interacts with the changed composition of the target. The interaction discharges a plasma alloy and the alloy condenses on the anode surface in the sputter chamber. The condensed alloy produces an alloy film.