Gradient Encapsulant for Stretchable Electronics

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Solution Overview

Problem

The integration of rigid electronic devices with stretchable materials in wearable technology often leads to fractures and tears due to the mismatch in elastic moduli, causing damage to both the electronics and the fabric, especially under cyclic stretching.

Innovation Solution

A gradient encapsulating material with an elastic modulus greater than the stretchable substrate but less than the electronic device is applied to create a smooth transition between the rigid and flexible areas, inhibiting fracture, tearing, and delamination by distributing stress more evenly.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If a rigid electronic device is integrated with a stretchable material, then the electronic device maintains its structural integrity and functionality, but the boundary between the rigid and stretchable areas is prone to breaking or tearing when subjected to stretching

Engineering Contradiction:

Improvestructural integrity of electronic deviceVSAvoidboundary integrity under stretching

Core Design Contradiction:

StrengthVSReliability

Solution Approach 1:

The encapsulating material is applied with a gradient elastic modulus distribution, where the modulus varies spatially from the rigid electronic device interface to the stretchable substrate interface. This creates locally optimized mechanical properties: higher modulus near the rigid device for structural support, and lower modulus near the stretchable substrate for flexibility and stress accommodation, preventing boundary failure

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The encapsulating material functions as a composite structure with spatially varying composition, combining regions of different elastic moduli within a single continuous material layer. This composite approach allows the material to simultaneously provide structural support and stress distribution, bridging the mechanical property gap between rigid electronics and flexible substrates

Inventive Principle:

Principle #40Composite materials

2Duration of action of moving object

If a rigid electronic device is integrated with a stretchable material, then the electronic device maintains its functionality, but the repeated stretching causes fracture and tearing that damages both the electronics and the fabric

Engineering Contradiction:

Improveuseful life of stretchable electronicsVSAvoidresistance to fracture and tearing

Core Design Contradiction:

Duration of action of moving objectVSReliability

Solution Approach 1:

The gradient encapsulating material serves as a pre-applied protective cushion between the rigid electronic device and the stretchable substrate. This cushioning layer is designed to absorb and distribute cyclic stretching stresses before they can concentrate at the boundaries and cause fracture or tearing, thereby extending the duration of reliable operation

Inventive Principle:

Principle #11Beforehand cushioning (Prior cushioning)

Solution Approach 2:

The elastic modulus parameter of the encapsulating material is changed spatially to create a gradient distribution. This parameter variation allows the material to adapt its mechanical response to different regions: providing stiffness near the rigid device for protection while offering compliance near the stretchable substrate for stress accommodation during cyclic deformation

Inventive Principle:

Principle #35Parameter changes

3Stability of the object's composition

If a rigid electronic device is integrated with a stretchable material, then the electronic device maintains its structural stability, but the mismatch in elastic moduli causes stress concentration that leads to delamination

Engineering Contradiction:

Improvestructural stability of electronic deviceVSAvoidadhesion between layers

Core Design Contradiction:

Stability of the object's compositionVSReliability

Solution Approach 1:

The encapsulating material exhibits local quality variations in its elastic modulus, being stiffer near the rigid electronic device for structural stability and more compliant near the stretchable substrate for stress distribution. This local property optimization prevents stress concentration at the interfaces, maintaining reliable adhesion between layers during cyclic stretching

Inventive Principle:

Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach significantly extends the useful life of stretchable electronics by preventing premature failure from stretching, allowing for greater flexibility without compromising the functionality of the devices.

Implementation Method 1

Methodology Applied

Scientific EffectStress distribution:

Data Source

PatentUS10206277B2Gradient encapsulant protection of devices in stretchable electronics

Publication Date: 2019.02.12 INTEL CORP

AI summary

In accordance with disclosed embodiments, there are provided methods, systems, and apparatuses for gradient encapsulant protection of devices in stretchable electronic. For instance, in accordance with one embodiment, there is an apparatus with an electrical device on a stretchable substrate; one or more stretchable electrical interconnects coupled with the electrical device; one or more electrical components electrically coupled with the electrical device via the one or more stretchable electrical interconnects; and a gradient encapsulating material layered over and fully surrounding the electrical device and at least a portion of the one or more stretchable electrical interconnects coupled thereto, in which the gradient encapsulating material has an elastic modulus greater than the stretchable substrate and in which the elastic modulus of the gradient encapsulating material is less than the electrical device. Other related embodiments are disclosed.