Gradient Metal Connecting Component for Thermal Expansion Mismatch
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Solution Overview
Problem
The bonding of components with different materials and thermal expansion coefficients often results in mechanical tensions, leading to bending or bowing, which can cause failure, and existing solutions require matching coefficients or high-temperature processing.
Innovation Solution
A connecting component with varying metal concentrations and a multi-layer metal arrangement is used, where a ternary region forms at a low temperature to minimize initial bonding tension, and further heating creates thermally stable regions without melting, fixing the components securely.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If components with different thermal expansion coefficients are bonded directly, then material versatility is improved, but mechanical tension and bowing increase leading to connection failure
Solution Approach 1:
A connecting component with multi-layer metal arrangement (at least three different metals) is introduced as an intermediary between the first and second components. This connecting component has different regions with varying metal concentrations that are optimized to bond with each specific component, thereby enabling connection between components with different thermal expansion coefficients while managing the mechanical tensions through the gradient structure.
Solution Approach 2:
The connecting component features regions with locally optimized metal concentrations. Each region has a specific composition tailored to bond with the adjacent component it contacts. This local quality variation allows the connecting component to adapt to different thermal expansion coefficients of the bonded components at each interface, reducing overall mechanical stress.
2Strength
If high-temperature processing is used to bond components, then bonding strength is improved, but thermal expansion mismatch and bowing worsen
Solution Approach 1:
The invention changes the bonding parameters by using a multi-stage temperature approach. First, a preliminary bonding is performed at a lower temperature to establish initial connection. Then, a final bonding stage is conducted at elevated temperature to achieve optimal bond strength. The multi-layer metal arrangement with varying melting points enables this staged approach, allowing strong bonding while controlling thermal expansion effects through the gradient structure.
3Reliability
If matching thermal expansion coefficients is required for bonding, then connection stability is improved, but material selection flexibility deteriorates
Solution Approach 1:
The connecting component serves as a mediator that bridges components with mismatched thermal expansion coefficients. Its multi-layer metal structure with gradient concentrations is designed to compatibly interface with different materials, allowing stable connections between diverse component pairs (e.g., silicon wafers with sapphire) without requiring the components themselves to have matching expansion coefficients.
4Reliability
If expensive materials are used for bonding, then connection reliability is improved, but manufacturing cost increases
Solution Approach 1:
The connecting component is constructed as a composite of at least three different metals in a multi-layer arrangement with varying concentrations. This composite structure combines the beneficial properties of different metals (bonding affinity, ductility, thermal expansion characteristics) to achieve reliable connections between diverse components while avoiding the need for expensive specialty bonding materials. The gradient metal distribution optimizes both performance and cost-effectiveness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method allows for cost-effective bonding of components with different thermal expansion coefficients, preventing further tension and ensuring a temperature-stable connection, enabling the use of cheaper materials like silicon wafers with sapphire without bowing or bending.
Implementation Method 1
heating the arrangement to a first temperature at which the second metal and the third metal melt and form a ternary region comprising the second, the third and the fourth metal
Implementation Method 2
heating the arrangement to a second temperature at which the ternary region and the first metal are at least partly intermixed whereby a first region and a second region are produced
Implementation Method 3
the first and the second component each has a mean linear coefficient of thermal expansion wherein the mean linear coefficient of thermal expansion of the first component differs from that of the second component
Data Source
AI summary
A device is specified, said device comprising a first component (1), a second component (2), and a connecting component (3) comprising at least a first region (31) and at least a second region (32). The composition of the first region (31) differs from the composition of the second region (32). The connecting component (3) is arranged between the first component (1) and the second component (2). The connecting component (3) comprises different kinds of metals, the first region (31) of the connecting component (3) comprises a first metal (41), and the concentration of the first metal (41) is greater in the first region (31) than the concentration of the first metal (41) in the second region (32).