Graphene-Coated Conductive Posts for Fine-Pitch Interconnects
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Solution Overview
Problem
Semiconductor devices face challenges with high density and fine pitch electrical interconnects that lead to warpage and electrical shorting issues, particularly in dual-side molding system-in-package (DSmSiP) modules, which are exacerbated by lamination processes.
Innovation Solution
The use of graphene-coated copper core shells for conductive posts in semiconductor devices, combined with a shielding layer, to enhance electrical conductivity and reduce manufacturing costs while minimizing warpage and shorting risks.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If high density and fine pitch electrical interconnects are used, then signal transmission capability is improved, but warpage and electrical shorting issues occur
Solution Approach 1:
The patent employs a composite conductive post structure consisting of a copper core surrounded by a graphene shell. The copper core provides high electrical conductivity for signal transmission, while the graphene shell offers exceptional mechanical strength and rigidity. This composite material approach enables the structure to maintain structural integrity and resist warpage during lamination processes, while simultaneously achieving high electrical conductivity for dense interconnect applications.
2Ease of manufacture
If conventional conductive posts are used in lamination processes, then manufacturing is simplified, but warpage and deviation between post areas and no-post areas occur
Solution Approach 1:
The graphene-copper composite structure provides superior mechanical properties including high rigidity and dimensional stability. This enables the conductive posts to maintain their position and alignment during lamination processes, reducing deviation between post areas and no-post areas while preserving ease of manufacture.
3Reliability
If copper cores are used for high electrical conductivity, then signal transmission is improved, but oxidation and reliability issues arise
Solution Approach 1:
The graphene shell serves as an intermediary protective layer between the copper core and the external environment. It completely encapsulates the copper core, preventing oxygen access and oxidation reactions. The graphene layer maintains the copper's high electrical conductivity while eliminating oxidation-related reliability issues.
Solution Approach 2:
The copper-graphene composite structure combines the high electrical conductivity of copper with the oxidation resistance and chemical stability of graphene. This composite approach preserves the electrical performance benefits of copper while eliminating its susceptibility to oxidation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables high-density, low-pitch electrical interconnects with improved signal transmission and reduced manufacturing complexity, addressing warpage and shorting issues in DSmSiP modules.
Implementation Method 1
conductive posts with graphene Cu core shells
Data Source
AI summary
A semiconductor device has a substrate and an electrical component disposed over a first surface of the substrate. A first encapsulant is deposited over the first surface of the substrate. A second encapsulant is deposited over a second surface of the substrate with a via formed in the second encapsulant. A conductive material containing a graphene core shell is deposited in the via in the second encapsulant to form a conductive post. The graphene core shell can have a copper core with a graphene coating formed over the copper core. The conductive material has a matrix to embed the graphene core shell. The conductive material can have a plurality of cores covered by graphene and the graphene is interconnected within the conductive material to form an electrical path. The conductive material can have thermoset material or polymer or composite epoxy type matrix to embed the graphene core shell.