Embedded Graphene-Copper Shielding Layers for Oxidation-Resistant EMI Control
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Solution Overview
Problem
Copper (Cu) shielding materials in semiconductor devices are susceptible to oxidation, which compromises their electrical conductivity and effectiveness in reducing electromagnetic interference (EMI) and radio frequency interference (RFI).
Innovation Solution
Embedding graphene core shells within a shielding layer between encapsulants to enhance electrical conductivity and protect against oxidation, using materials like graphene-coated copper cores embedded in a matrix, which are printed using methods such as electrohydrodynamic (EHD) jet printing or aerosol jet printing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If copper shielding material is used, then cost-effectiveness is improved, but oxidation resistance deteriorates
Solution Approach 1:
The patent applies composite materials by combining copper core particles with a protective coating layer to form a composite shielding material. The copper core provides cost-effectiveness and electrical conductivity, while the coating layer provides oxidation resistance. This composite structure resolves the contradiction by integrating the advantages of both materials and eliminating their individual disadvantages.
2Reliability
If graphene core shells are embedded, then oxidation resistance is improved, but manufacturing complexity increases
Solution Approach 1:
The patent employs parameter changes by utilizing controlled chemical vapor deposition (CVD) processes to grow graphene shells on copper core particles. By optimizing parameters such as temperature, pressure, and gas flow rates, the manufacturing process achieves high-quality graphene coating with consistent properties, thereby reducing variability and simplifying quality control despite the advanced material involved.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The graphene core shells provide improved electrical conductivity and resistance to oxidation, effectively reducing EMI and RFI while maintaining cost-effectiveness and structural integrity.
Implementation Method 1
An electromagnetic shielding material is commonly conformally applied over the encapsulant. The electromagnetic shielding material reduces or inhibits electromagnetic interference (EMI), radio frequency interference (RFI), and other inter-device interference
Implementation Method 2
Cu shielding is subject to oxidation in the atmosphere. A shielding layer robust to the environment with even better electrical conductivity is desired
Implementation Method 3
utilizing advanced printing techniques like EHD jet printing
Implementation Method 4
aerosol jet printing
Data Source
AI summary
A semiconductor device has a substrate and an electrical component disposed over the substrate. A first encapsulant is deposited over the electrical component and substrate. A first shielding layer with a graphene core shell is formed on a surface of the first encapsulant. A second encapsulant is deposited over the first encapsulant and first shielding layer. A second shielding layer is formed over the second encapsulant. The first shielding layer is formed at least partially in an opening of the first encapsulant. The graphene core shell has a copper core. The first shielding layer has a plurality of cores covered by graphene and the graphene is interconnected within the first shielding layer to form an electrical path. The electrical path dissipates any charge incident on shielding layer, such as an ESD event, to reduce or inhibit the effects of EMI, RFI, and other inter-device interference.