Graphene-Coated Interconnects for Heat-Resistant Semiconductor Packaging
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Solution Overview
Problem
Semiconductor devices face challenges with heat dissipation and internal stress due to high processing demands and shrinking sizes, with existing vertical interconnects being inadequate in terms of heat dissipation and hardness.
Innovation Solution
The use of graphene-coated interconnects, which provide enhanced electrical conductivity, thermal conductivity, and hardness, along with improved solderability, to form semiconductor packages that can withstand high temperatures and internal stresses.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional vertical interconnects are used in semiconductor packages, then the device structure is simple and manufacturing is easier, but heat dissipation capability is insufficient and mechanical strength is inadequate under high temperature and stress conditions
Solution Approach 1:
The patent applies composite materials by coating conventional interconnect structures with graphene material. This creates a composite interconnect system where the base interconnect provides structural support and the graphene coating provides enhanced thermal conductivity and mechanical strength. The composite structure resolves the contradiction by improving heat dissipation capability without fundamentally changing the overall interconnect architecture, thus maintaining manufacturing feasibility while achieving superior thermal performance.
Solution Approach 2:
The patent changes the thermal and mechanical parameters of the interconnect structure by applying a graphene coating. This coating fundamentally alters the thermal conductivity parameter and mechanical strength parameter of the interconnect without changing its basic geometric parameters or electrical function. The parameter change approach allows the interconnect to withstand higher temperatures and stresses while maintaining the same structural form factor.
2Strength
If conventional vertical interconnects are used, then manufacturing processes are simpler, but the interconnects cannot withstand high internal stresses from vibration and physical shock
Solution Approach 1:
The graphene-coated interconnect structure creates a composite material system where the underlying interconnect provides structural framework and the graphene layer provides enhanced mechanical strength and hardness. This composite approach allows the interconnect to withstand high internal stresses from vibration and physical shock while using standard interconnect manufacturing processes for the base structure, thus resolving the contradiction between strength improvement and manufacturing simplicity.
Solution Approach 2:
The graphene coating acts as an intermediary layer between the interconnect structure and the harsh environmental conditions (vibration, shock, high temperature). This intermediary layer protects the base interconnect material from direct exposure to stress and thermal degradation, thereby enhancing mechanical strength without requiring fundamental changes to the manufacturing process for the underlying structure.
3Reliability
If graphene-coated interconnects are used, then heat dissipation and mechanical strength are improved, but the manufacturing process becomes more complex
Solution Approach 1:
The patent applies parameter changes by modifying the surface properties of existing interconnects through graphene coating rather than redesigning the entire interconnect system. This approach changes the thermal and mechanical parameters of the interconnect while maintaining compatibility with conventional interconnect manufacturing processes. The coating can be applied as an additional step without fundamentally altering the core manufacturing methodology, thus improving reliability while limiting the increase in manufacturing complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The graphene-coated interconnects improve heat dissipation and mechanical strength, enabling higher performance in high-bandwidth applications while reducing manufacturing costs.
Implementation Method 1
The graphene coating 124 has a low moisture permeability and a high thermal conductivity of 4000-5000 W/mK
Implementation Method 2
Graphene-coated interconnects 130 with graphene coating 124 have 100-times the electrical conductivity of Cu balls alone
Implementation Method 3
Graphene coating 124 also reduces or eliminates oxidation of core 120
Data Source
AI summary
A semiconductor device includes a first substrate and a second substrate. A graphene-coated interconnect is disposed between the first substrate and second substrate. A semiconductor die is disposed between the first substrate and second substrate. The first substrate is electrically coupled to the second substrate through the graphene-coated interconnect. An encapsulant is deposited between the first substrate and second substrate.