Graphene Fabrication on Silicon via Van-der-Waals Functional Layer

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Solution Overview

Problem

Current methods for growing graphene on silicon substrates face challenges such as incompatibility with existing silicon processing technology, environmental concerns, high growth temperatures, and the production of thick, distorted, or non-parallel graphene films using plasma-enhanced chemical vapor deposition (PECVD).

Innovation Solution

The use of a van-der-Waals functional layer on a silicon substrate, which allows carbon atoms to form a two-dimensional graphene layer through van-der-Waals-like forces, enabling controlled and structured growth of graphene layers, compatible with silicon technology and reducing environmental impact.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If graphene is grown on metal substrates using chemical vapor deposition, then graphene layers can be produced, but mechanical transfer is required which is incompatible with silicon processing technology and raises environmental concerns

Engineering Contradiction:
Improvecompatibility with silicon processing technologyVSAvoidprocess complexity
Core Design Contradiction:
Ease of manufactureVSDevice complexity

Solution Approach 1:

The patent introduces a silicon oxide layer as an intermediary substrate between the silicon processing environment and the graphene growth process. This intermediary allows graphene to be grown directly on silicon-compatible substrates using plasma-enhanced chemical vapor deposition, eliminating the need for metal substrate transfer while maintaining compatibility with existing silicon processing technology

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent replaces the mechanical transfer process (peeling and transferring graphene from metal substrates) with direct in-situ growth on silicon oxide. This substitution eliminates the complex mechanical handling steps and associated environmental concerns while achieving the same goal of producing graphene layers compatible with silicon devices

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

2Temperature

If graphene is grown epitaxially on silicon carbide, then graphene layers can be produced, but high temperatures above 1000°C are required which are beyond typical silicon processes

Engineering Contradiction:
Improvegrowth temperatureVSAvoidcompatibility with silicon processing technology
Core Design Contradiction:
TemperatureVSEase of manufacture

Solution Approach 1:

The patent changes the substrate material from silicon carbide to silicon oxide, which fundamentally alters the growth temperature requirements. Silicon oxide allows graphene growth at plasma-enhanced temperatures (below 1000°C) rather than the high temperatures needed for silicon carbide epitaxial growth, making the process compatible with standard silicon processing technology

Inventive Principle:
Principle #35Parameter changes

3Manufacturing precision

If plasma-enhanced chemical vapor deposition is used to grow graphene on insulators, then graphene can be produced at lower temperatures, but the films are either thick, distorted, or do not grow parallel to the substrate

Engineering Contradiction:
Improvegraphene film qualityVSAvoidprocessability
Core Design Contradiction:
Manufacturing precisionVSEase of manufacture

Solution Approach 1:

The patent applies local quality by creating patterned silicon oxide regions with specific surface properties that promote uniform, parallel graphene growth. By controlling the local surface characteristics of the silicon oxide substrate, the patent achieves high-quality, undistorted graphene films that grow parallel to the substrate while maintaining processability

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This method enables the fabrication of high-frequency electronic components with graphene layers in their active zones, allowing for improved performance and integration into existing semiconductor device production processes while minimizing environmental concerns.

Implementation Method 1

The van-der-Waals functional layer provides that substantially only van-der-Waals like forces contribute to binding carbon atoms of the graphene layer to the van-der-Waals functional layer

Methodology Applied
Scientific Effectvan-der-Waals force: Van der Waals Force

Implementation Method 2

Graphene deposition using plasma-enhanced chemical vapor deposition (PECVD)

Methodology Applied
Scientific Effectplasma-enhanced chemical vapor deposition: Plasma Enhanced Chemical Vapour Deposition

Data Source

PatentEP2458620B1Fabrication of graphene electronic devices using step surface contour
Publication Date: 2021.12.01 IHP GMBH INNOVATIONS FOR HIGH PERFORMANCE MICROELECTRONICS LEIBNIZ INSTITUT FÜR INNOVATIVE MIKROELEKTRONIK
  • EP2458620B1 patent drawingFigure 1~5
  • EP2458620B1 patent drawingFigure 6~7
  • EP2458620B1 patent drawingFigure 8~10

AI summary

A method for fabricating an electronic component (100), comprising: - providing a substrate (1);and - depositing a graphene layer (5); wherein - the substrate (1) is either provided with a van-der-Waals functional layer (2) or a van-der-Waals functional layer (2) is deposited on the substrate before depositing the graphene layer; - a surface step contour (3) is formed; and - growth of the graphene layer (5) is seeded at the step contour (3).