Surface Grinding Apparatus with Edge Trimming Bridge
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Solution Overview
Problem
Conventional semiconductor wafer processing requires separate machines for surface grinding and edge trimming, leading to increased capital equipment costs, space requirements, and manufacturing complexity due to the need for additional process steps, which can result in wafer edges becoming sharp and fragile, prone to chipping.
Innovation Solution
A surface grinding apparatus adapted to perform both surface grinding and edge trimming operations on a single machine, utilizing a modified design with a single grind chamber, adjustable grinding wheels, and a seal system that allows for edge trimming positions between spindles, enabling concurrent processing of two workpieces.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If separate machines are used for surface grinding and edge trimming, then each machine can be optimized for its specific function, but capital equipment costs increase and space requirements increase
Solution Approach 1:
The patent combines surface grinding and edge trimming operations into a single integrated machine platform. The system uses a common spindle and workpiece holding mechanism that can perform both grinding operations and edge trimming by changing the orientation and position of the grinding wheel, eliminating the need for separate machines while maintaining functional capabilities
Solution Approach 2:
The grinding wheel assembly is designed to be multi-functional, capable of performing both surface grinding and edge trimming operations. The wheel can be positioned and oriented to contact different surfaces of the workpiece, allowing a single device to execute multiple machining functions that previously required separate specialized machines
2Manufacturing precision
If separate machines are used for surface grinding and edge trimming, then each process can be independently controlled, but manufacturing complexity increases due to additional process steps
Solution Approach 1:
The patent integrates multiple process steps into a single continuous operation. The workpiece remains on the same spindle throughout both surface grinding and edge trimming, and the grinding wheel assembly can transition between operations without requiring workpiece removal or machine changes, thereby reducing manufacturing complexity while maintaining precision control
3Reliability
If edge trimming is performed after surface grinding on separate machines, then the processes can be independently optimized, but wafer edges become sharp and fragile, prone to chipping
Solution Approach 1:
The system performs edge trimming before surface grinding operations. By removing excess material from the wafer edges first, the subsequent grinding process operates on already-thinned edges, creating a more robust final edge structure that is less prone to chipping and fragmentation during the grinding operation
4Device complexity
If a single machine performs both surface grinding and edge trimming, then capital equipment costs decrease and space requirements are minimized, but the machine design becomes more complex
Solution Approach 1:
The machine employs a universal spindle and workpiece holding mechanism that can accommodate both surface grinding and edge trimming operations. The grinding wheel assembly is designed with adjustable positioning and orientation capabilities, allowing it to function as both a surface grinding tool and an edge trimming tool, thereby reducing the need for multiple specialized machines
Solution Approach 2:
The system uses dynamic, adjustable components including a movable grinding wheel assembly that can change its position and orientation relative to the workpiece. This dynamic configuration allows the same hardware to adapt to different operational requirements (surface grinding vs. edge trimming) without requiring separate fixed installations for each function
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution reduces capital equipment costs, minimizes space requirements, and decreases manufacturing complexity while creating more robust wafer edges by performing edge trimming before surface grinding, thereby reducing chipping and enhancing wafer durability.
Implementation Method 1
surface grinding or polishing operations... wafer back grinding is a process in semiconductor device fabrication in which the backside of a wafer is ground... wafer face grinding is a process in semiconductor device fabrication in which the front or active surface of the wafer is planarized
Data Source
AI summary
An apparatus for performing both edge trimming and surface grinding includes two spindles for holding two workpieces, a bridge element laterally movable relative to the spindles, and two grinding wheels coupled to the bridge element. The apparatus may be a surface grinding apparatus that includes a system for enabling the surface grinding apparatus to additionally perform edge trimming. A method for processing the workpieces entails placing the two workpieces on the two spindles of the apparatus, directing the bridge element to move laterally to an edge trimming position to trim the outer edge of one workpiece using one of the grinding wheels, to move laterally to another edge trimming position to trim the outer edge of the other workpiece using one of the grinding wheels, and to move laterally to surface grinding positions to perform surface grinding on both of the workpieces using one or both of the grinding wheels.