Grinding Process for Light-Emitting Device Baffle Wall Overflow
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Solution Overview
Problem
The manufacturing process of light-emitting devices often results in white glue overflowing from channels, leading to adhesion and vulcanization issues on the surface, which affects the device's quality and light emission.
Innovation Solution
A method involving die bonding, encapsulation, primary dicing, filling with a baffle wall material, grinding, and secondary dicing, where the grinding process specifically addresses the overflow by removing excess baffle wall material from the top surface, ensuring a smooth and efficient production process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If baffle wall material is filled in the channel to limit light-emitting angle, then light emission control is improved, but white glue overflows onto the top surface causing adhesion and vulcanization issues
Solution Approach 1:
The patent applies preliminary action by performing the grinding process after filling the baffle wall material but before final assembly. The grinding step removes excess material that caused the overflow problem, preventing adhesion and vulcanization issues while maintaining the light-emitting angle control function. This sequential approach solves the contradiction by addressing the surface quality issue after the filling function is established.
2Manufacturing precision
If grinding process is applied to remove excess baffle wall material, then surface quality is improved, but production time increases
Solution Approach 1:
The patent applies parameter changes by optimizing the grinding parameters including grinding wheel speed, feed rate, and depth of cut. By carefully controlling these parameters, the grinding process efficiently removes excess material with minimal additional time, balancing surface quality improvement with production efficiency. The grinding depth is controlled to remove only the necessary excess baffle wall material without over-processing.
3Illumination intensity
If the channel is completely filled with baffle wall material to ensure light blocking, then light emission control is improved, but material waste increases
Solution Approach 1:
The patent applies the taking out principle by removing the excess baffle wall material through the grinding process. Instead of filling the channel completely and accepting the waste, the grinding step extracts the unnecessary excess material, achieving the required light blocking effectiveness with minimal material waste. This approach optimizes material usage while maintaining functional performance.
Data Source
AI summary
Provided are a method for machining a device and the device. The method for machining a device includes die bonding, primary dicing, filling by a baffle wall material, grinding and secondary dicing. In the step of grinding machining, a semi-finished product is placed on a platform surface of a grinding and fixing platform, a grinding working end of a grinding device is controlled to operate, and with the platform surface of the grinding and fixing platform as a height reference, the grinding working end grinds from above the semi-finished product toward the grinding and fixing platform and operates to a preset height. Through the special machining process, the probability of the appearance of white glue on a top surface of the device is reduced, which is conducive to ensuring a production yield of the device.