Grinding Method for Workpiece Thickness Distribution Control
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Solution Overview
Problem
The existing grinding methods for workpieces are inefficient due to the need for prolonged standby times during thickness measurement, which disrupts the grinding process and results in increased thickness variations and reduced productivity.
Innovation Solution
A grinding method that measures the workpiece thickness in a non-contact region during grinding and in the contact region after separation, allowing for concurrent grinding and measurement, and includes multiple measurement points to adjust the tilt of the chuck table and grinding wheel for improved thickness distribution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If the thickness distribution is measured after completing the grinding of a workpiece, then the measurement can be performed in the contact region, but the standby time increases and grinding efficiency decreases
Solution Approach 1:
The patent measures the thickness distribution in the non-contact region during the grinding process itself, rather than waiting until after grinding is complete. This preliminary measurement approach allows the tilt adjustment to be made while the workpiece is still being processed, eliminating the need for extended standby time and improving overall grinding efficiency.
Solution Approach 2:
The patent enables continuous grinding operation by performing thickness measurements in the non-contact region during the grinding process. The measurement and grinding actions occur simultaneously without interrupting the useful action, maintaining continuous productivity while still obtaining necessary measurement data for tilt adjustment.
2Productivity
If the thickness distribution is measured during grinding in the non-contact region, then the standby time is reduced and efficiency improves, but the contact region thickness cannot be measured
Solution Approach 1:
The patent divides the workpiece into two regions: a non-contact region where thickness measurement occurs during grinding, and a contact region where grinding stones apply pressure. By measuring in the non-contact region during the process and using this data to adjust tilt, the system obtains sufficient measurement information without compromising overall measurement precision or requiring contact-based measurement.
Solution Approach 2:
The non-contact region serves as an intermediary measurement zone that provides thickness distribution data without interfering with the grinding process in the contact region. This intermediary measurement approach allows the system to obtain necessary information for tilt adjustment while maintaining continuous grinding operation.
3Manufacturing precision
If the tilt of the chuck table is adjusted based on thickness distribution measurement, then the thickness variations are reduced, but the measurement workpiece may fail to meet specifications
Solution Approach 1:
The patent implements a feedback mechanism where thickness distribution measurements taken during the grinding process are used to adjust the tilt of the chuck table in real-time. This feedback loop allows the system to optimize thickness uniformity dynamically, ensuring that even the workpiece used for measurement meets specifications by making adjustments based on actual measured data before the process completes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces the time required for thickness measurement, enhances the efficiency of the grinding process, and minimizes the number of workpieces that fail to meet specifications by allowing for real-time tilt adjustments during processing.
Implementation Method 1
a grinding wheel with a plurality of grinding stones included therein is mounted on a distal end portion of the spindle. The workpiece is ground and thinned by holding the workpiece on the holding surface of the chuck table, and bringing the grinding stones into contact with the workpiece
Data Source
AI summary
A grinding method of a workpiece includes a holding step of holding the workpiece on a holding surface of a chuck table, a grinding step of, after the holding step, measuring a thickness of the workpiece in a non-contact region other than a contact region between the workpiece and grinding stones while grinding the workpiece with a grinding wheel including the grinding stones, and a measurement step of, after the grinding step, relatively moving and separating the workpiece and the grinding stones from each other, and measuring the thickness of the workpiece in the contact region during or after the relative movement of the workpiece and the grinding stones.