Groove-Based Flexible Display Panel Manufacturing
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Solution Overview
Problem
Current flexible OLED manufacturing processes require a carrier glass substrate that needs to be cut and then stripped, which is inefficient and costly, and may cause damage to the substrate.
Innovation Solution
A method of forming a groove on a carrier substrate, coating and patterning a flexible substrate within the groove, and directly peeling the flexible display panel off the carrier substrate without cutting, using a laser stripper machine.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If laser cutting is used to separate the flexible display panel from the carrier substrate, then the panel can be formed, but production efficiency decreases and costs increase
Solution Approach 1:
The groove is pre-formed on the carrier substrate before the flexible substrate is coated, creating a predetermined separation path that enables direct peeling without cutting operations. This preliminary structuring eliminates the need for subsequent laser cutting steps.
Solution Approach 2:
The flexible substrate is extracted from the carrier substrate through direct peeling along the groove interface, separating the finished display panel from the carrier without requiring cutting operations. This extraction method simplifies the manufacturing process.
2Reliability
If laser cutting is used to separate the flexible display panel, then the panel can be formed, but substrate damage risk increases
Solution Approach 1:
The groove acts as an intermediary structure that facilitates clean separation between the flexible substrate and carrier substrate. By providing a predefined separation interface, it prevents the substrate damage that would occur during laser cutting operations.
Solution Approach 2:
The mechanical laser cutting process is replaced with a peeling operation along the groove interface. This substitution eliminates the harmful thermal and mechanical effects of laser cutting while achieving the same separation goal.
3Manufacturing precision
If the entire carrier substrate is coated with flexible base material, then complete coverage is achieved, but material waste increases
Solution Approach 1:
The flexible substrate material is applied locally within the groove area rather than coating the entire carrier substrate. This localized application ensures complete coverage of the flexible substrate while minimizing material waste by limiting coating to only the necessary region.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method reduces production costs and improves efficiency by eliminating the need for laser cutting and minimizing substrate damage, enabling direct formation and removal of flexible display panels on a glass substrate.
Implementation Method 1
a flexible display panel is peeled from the carrier glass substrate with a laser stripping machine (laser lift-off)
Data Source
AI summary
A method for manufacturing a flexible display panel includes the steps of: step S1, providing a carrier substrate on which a groove conforming to a size of a flexible display panel is formed on one side of the carrier substrate; step S2, formed a flexible substrate in the groove; step S3, forming a thin film transistor, an organic light emitting diode layer, and an encapsulation layer on the flexible substrate to form the flexible display panel; and step S4, directly remove the flexible display panel from the carrier substrate.