Groove Packaging Structure for OLED Moisture Barrier
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Solution Overview
Problem
Existing packaging techniques for environmentally-sensitive electronic devices like OLEDs and thin film photovoltaic cells face inefficiencies in space utilization and degradation due to limited water-resistant and gas-resistant properties, especially under UV light exposure.
Innovation Solution
A packaging structure with a groove defined on the inactive area of the optical element, incorporating a light-transparent substrate, conductive layers, and alternating sealing and barrier layers made of inorganic metallic oxides and polymers, respectively, to enhance water-resistant and gas-resistant properties and reduce structural waste.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional packaging materials (EVA or barrier film) are used, then moisture-resistant ability is achieved, but the material degrades or turns yellowish under UV light exposure and has limited lifespan
Solution Approach 1:
The patent employs a composite packaging structure consisting of multiple inorganic layers (first inorganic layer, second inorganic layer) combined with organic sealing layers. This composite material approach provides superior UV resistance and moisture barrier properties compared to single-material solutions, preventing degradation and yellowing while extending lifespan.
2Reliability
If packaging structures from prior arts are used, then sealing effect is achieved, but space utilization is inefficient due to increased packaging thickness
Solution Approach 1:
The patent introduces groove structures that extend the sealing interface into the vertical dimension, creating overlapping sealing regions between adjacent packaging elements. This dimensional approach increases the effective sealing area without proportionally increasing the overall packaging thickness, thereby improving space utilization.
Solution Approach 2:
The packaging structure is divided into multiple functional layers (first inorganic layer, first sealing layer, second sealing layer, second inorganic layer) with distinct roles. This segmentation allows each layer to be optimized for its specific function while maintaining overall compactness and efficient space utilization.
Data Source
AI summary
A packaging structure with groove includes a substrate, a lower conductive layer, an optical element, a sealing layer and a barrier layer. The lower conductive layer is arranged on one face of the substrate. The optical element is arranged on one face of the lower conductive layer. The upper conductive layer is arranged on one face of the optical element. The packaging structure further comprises a groove defined on an inactive area of the optical element. The sealing layer is arranged on one face of the optical element and on one face of the upper conductive layer. The barrier layer is arranged on one face of the sealing layer. Because the groove is formed on inactive area of the optical element to enhance lateral sealing tightness, extended interface is provided between sealing layer/barrier layer and the substrate, thus enhance the water-resistant and gas-resistant property for package.