Grooved Disk Carrier for Uniform Glass Substrate Polishing
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Solution Overview
Problem
The existing polishing processes for glass substrate disks in hard disk drives face issues such as slow and inconsistent removal rates, leading to reduced parts per hour (PPH), decreased carrier and polishing pad life, increased slurry consumption, and compromised quality control, which elevate production costs.
Innovation Solution
The implementation of grooves on the carrier body of the polishing carrier, configured to facilitate slurry flow between the carrier and polishing pads during the fine polishing stage, enhances slurry distribution and retention, thereby improving removal consistency and efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If grooves are added to the carrier body to facilitate slurry flow, then slurry distribution and removal consistency are improved, but device complexity increases
Solution Approach 1:
The carrier body is segmented with multiple grooves of different patterns and configurations to create distinct slurry flow channels. These grooves divide the slurry distribution function into multiple pathways, ensuring uniform slurry flow across different regions of the polishing pad and improving removal consistency.
Solution Approach 2:
Different regions of the carrier body are provided with grooves of varying depths, widths, and patterns tailored to local requirements. The groove configuration is optimized for each specific area to achieve uniform slurry distribution across the entire polishing interface, addressing local variations in slurry flow needs.
2Productivity
If grooves are added to the carrier body to facilitate slurry flow, then polishing efficiency is improved, but manufacturing complexity increases
Solution Approach 1:
The grooves are designed with specific parameter ranges including depth between 0.05-0.5mm, width between 0.5-5mm, and spacing between 5-50mm. These parameter specifications optimize slurry flow characteristics while remaining manufacturable using conventional precision machining techniques, balancing polishing efficiency with ease of manufacture.
3Manufacturing precision
If grooves are added to the carrier body to facilitate slurry flow, then slurry distribution is improved, but carrier material consumption increases
Solution Approach 1:
The grooves are designed with moderate depth (0.05-0.5mm) and width (0.5-5mm) parameters that provide sufficient slurry flow facilitation without excessive material removal. This partial action approach achieves the necessary slurry distribution uniformity while minimizing carrier material consumption and maintaining structural integrity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The grooved carrier design increases the removal rate by about 20% compared to non-grooved carriers, reducing polishing time, slurry consumption, and overall production costs while maintaining substrate quality.
Implementation Method 1
the first and second grooves are configured to facilitate a flow of a polishing slurry between the carrier body and the polishing pad during the polishing
Implementation Method 2
the first and second grooves are configured to facilitate a flow of a polishing slurry between the carrier body and the polishing pad during the polishing
Implementation Method 3
the carrier body is configured to be rotated relative to an adjacent polishing pad to polish a glass substrate
Implementation Method 4
the carrier body is configured to be rotated relative to an adjacent polishing pad to polish a glass substrate
Data Source
AI summary
A carrier for use in a polishing machine and a method for using the carrier during the polishing of glass substrate disks intended for use in the hard disk media of a hard disk drive. Grooves are provided in top and bottom surfaces of the carrier to, e.g., increase the flow of polishing slurry between the carrier and a pair of upper and lower polishing pads of the polishing machine during a polishing operation. Opposing grooves within the top and bottom surfaces of the carrier may be staggered or offset relative to one another. Slurry passage holes may be provided in the carrier that intersect with the grooves to allow for the passage of slurry into the grooves during polishing. Method and apparatus examples are described.