Grooved Cylindrical Repeller for Arc Chamber Heat Uniformity
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Solution Overview
Problem
The existing ion generating apparatus in semiconductor wafer ion implantation processes faces issues with non-uniform heat distribution and the risk of short circuits due to flakes forming on the repeller, leading to frequent preventive maintenance and contamination of the arc chamber.
Innovation Solution
A repeller with a cylindrical shape and striped grooves on its outer surface is designed to enhance heat dissipation and maintain insulation, preventing short circuits and extending the maintenance cycle.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a disc-shaped repeller is used close to the arc chamber, then electron reflection function is achieved, but heat distribution becomes non-uniform and short circuit risk increases
Solution Approach 1:
The repeller is changed from a disc shape to a cylindrical shape. This curvature change allows for more uniform heat distribution across the repeller surface and improves heat dissipation efficiency, resolving the non-uniform heat distribution problem while maintaining the electron reflection function
Solution Approach 2:
Grooves are formed on the outer surface of the cylindrical repeller, creating a porous-like structure. This increases the surface area for heat dissipation and prevents flake formation by reducing localized heat concentration, thereby improving both heat distribution uniformity and preventing short circuits
2Reliability
If a disc-shaped repeller is used close to the arc chamber, then electron reflection function is achieved, but flake formation occurs leading to short circuits
Solution Approach 1:
The cylindrical shape replaces the disc shape, eliminating the geometric features that cause non-uniform heat distribution and subsequent flake formation. The curved surface distributes thermal stress more evenly, preventing material degradation and flake detachment
Solution Approach 2:
The grooves on the repeller surface create a structured pattern that prevents flake formation by reducing heat concentration points. This porous-like structure also facilitates better heat dissipation, maintaining material integrity and preventing short circuits
3Ease of manufacture
If conventional repeller design is used, then short circuit prevention is difficult, but maintenance frequency increases due to flaking
Solution Approach 1:
The cylindrical design with grooves provides inherent insulation reinforcement by preventing flake formation. This structural improvement extends the maintenance cycle and reduces the frequency of preventive maintenance operations
Solution Approach 2:
The grooved surface structure enhances insulation properties by preventing direct contact between flakes and the arc chamber. This design extension maintains operational reliability for longer periods, reducing maintenance time loss
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The repeller design ensures stable and uniform temperature distribution, reducing the occurrence of flakes and short circuits, thereby prolonging the maintenance cycle and maintaining consistent impurity doping in semiconductor wafers.
Implementation Method 1
A repeller with a cylindrical shape and striped grooves on its outer surface is designed to enhance heat dissipation
Implementation Method 2
a repeller may be installed to face the cathode, and the repeller may serve to reflect electrons emitted from the cathode toward the cathode so that electrons are concentrated to a certain region
Implementation Method 3
A repeller with a cylindrical shape and striped grooves on its outer surface is designed to enhance heat dissipation and insulation, preventing short circuits
Data Source
AI summary
A repeller may be mounted inside an arc chamber of an ion implantation apparatus for doping impurities into a surface film of a semiconductor wafer. The repeller may include a body including an outer circumferential surface and a surface area enlargement portion on the body. The surface area enlargement portion may include striped grooves continuously formed on the outer circumferential surface of the body at intervals in a longitudinal direction of the body.