Grooved Semiconductor Substrates for Full-Color LED Wavelength Control
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Solution Overview
Problem
Current full-color LED technologies face challenges in reducing size and cost while achieving high-definition displays with ultra-small light-emitting pixels, as existing methods rely on large packaging units and inefficient heat transfer processes.
Innovation Solution
A substrate with unit areas featuring grooves of varying depths, widths, and opening densities, filled with thermally conductive materials or air, which allows for differential heat transfer and light-emitting wavelengths, enabling the fabrication of smaller, cost-effective full-color LEDs with improved luminous efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If a conventional full-color LED packaging unit with size 1mm*1mm is used, then the packaging can accommodate three separate LED chips (red, green, blue) with standard bonding processes, but the overall size and cost of the full-color LED cannot be reduced further
Solution Approach 1:
The patent merges three separate LED chips (red, green, blue) into a single integrated light-emitting layer on one substrate. The substrate is divided into three regions corresponding to different colors, with each region having grooves of specific depths to control light emission. This integration eliminates the need for separate packaging and bonding processes for three chips, thereby reducing the overall packaging unit size while maintaining manufacturing feasibility through a unified growth process.
Solution Approach 2:
The patent applies local quality by creating regions with different groove depths on the substrate surface. Each color region (red, green, blue) has grooves with specific depth characteristics tailored to its wavelength requirements. This localized structural differentiation enables precise control over light emission properties for each color while maintaining a compact integrated structure, resolving the contradiction between size reduction and manufacturing ease.
2Adaptability or versatility
If uniform grooves are used across all subunit areas, then the manufacturing process is simplified, but the light-emitting wavelengths cannot be differentiated to achieve full-color display
Solution Approach 1:
The patent implements local quality by varying the groove depth in different subunit areas corresponding to different color regions. The substrate is divided into multiple subunit areas, each with grooves of specific depths tailored to produce particular wavelengths. This localized structural variation enables wavelength differentiation for full-color display while maintaining a relatively simple overall groove pattern that can be manufactured using standard processes.
Solution Approach 2:
The patent segments the substrate into multiple unit areas, each containing subunit areas with different groove depth characteristics. This segmentation allows independent optimization of groove parameters for each color region (red, green, blue) to achieve specific light-emitting wavelengths. The segmented structure provides the necessary complexity for wavelength differentiation while maintaining manufacturing simplicity through modular design.
3Illumination intensity
If the substrate material is chosen for optimal optical properties, then light emission quality is improved, but heat transfer efficiency deteriorates
Solution Approach 1:
The patent utilizes phase transition by filling the grooves with materials that change thermal properties based on temperature or other conditions. The groove-filling material can transition between different phases or thermal conductivity states, enabling dynamic adjustment of heat transfer efficiency while maintaining optimal optical properties for light emission. This resolves the contradiction by providing temperature-dependent thermal management.
Solution Approach 2:
The patent employs composite materials by combining the substrate material (optimized for optical properties) with groove-filling materials (optimized for thermal management). The substrate provides excellent light emission characteristics, while the groove-filling materials provide enhanced heat dissipation pathways. This composite structure simultaneously achieves both optimal light emission quality and improved heat transfer efficiency, resolving the inherent trade-off between these two properties.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The approach results in reduced full-color LED size and cost, enhanced heat transfer efficiency, and adjustable light-emitting wavelengths, facilitating the production of high-definition displays and lighting units with improved luminous efficiency.
Implementation Method 1
there is a thermally conductive material in the groove
Implementation Method 2
Light-emitting diodes, or LEDs for short, radiate visible light by means of the recombination of electrons and holes
Data Source
AI summary
This application provides a semiconductor structure and substrate thereof, a method of manufacturing the semiconductor structure and substrate thereof. The substrate includes a plurality of unit areas, each of the unit areas includes at least two subunit areas, each of the subunit areas is provided with a groove, the groove is opened from a back side of the substrate; and in one of the unit areas, preset opening ratios of the subunit areas are different. A light-emitting layer is grown on a front side of the substrate; and in one of the unit areas, light-emitting wavelengths of the light-emitting layer in the subunit areas are different.