Grooved Vacuum Tip Assembly for Flat Die Pick-and-Place
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Solution Overview
Problem
Conventional pick and place tools cause deformation of thin integrated circuit dies during attachment, leading to non-uniform processing as die sizes shrink in semiconductor processes.
Innovation Solution
A vacuum tip with grooves on its surface, connected to a vacuum channel, providing increased contact surface area and even support to prevent die deformation, and a vacuum tip with multiple ring structures for enhanced suction without deformation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If conventional vacuum pick and place tools are used to handle thin integrated circuit dies, then the dies can be transported for manufacturing operations, but the dies undergo horizontal deformation during attachment and detachment
Solution Approach 1:
The vacuum tip surface is segmented into multiple discrete contact points arranged in a circular pattern, rather than using a single large contact surface. This segmentation allows the die to be supported at multiple locations simultaneously, distributing the vacuum force and preventing horizontal deformation while maintaining secure attachment
Solution Approach 2:
The contact points are arranged in a circular pattern on the vacuum tip surface, utilizing radial distribution in a two-dimensional plane. This circular arrangement provides uniform support around the die perimeter, preventing edge deformation and maintaining die flatness during handling
2Strength
If vacuum force is applied to attach thin dies to the tip, then secure attachment is achieved, but horizontal deformation occurs during attachment and detachment
Solution Approach 1:
The vacuum force is segmented and applied through multiple discrete contact points rather than a single concentrated area. This distributes the attachment strength across multiple locations, securing the die firmly while preventing localized stress that would cause horizontal deformation
Solution Approach 2:
Each contact point on the vacuum tip provides localized vacuum support at specific radial positions. This local quality approach ensures that vacuum force is applied uniformly around the die perimeter, maintaining die shape integrity while achieving sufficient attachment strength for secure handling
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Prevents die deformation, maintains die flatness during attachment, reduces scratches, and ensures uniform processing results, thereby improving yield and reducing defects.
Implementation Method 1
vacuum channel in fluid communication with a vacuum source... the grooves and the vacuum channel are in fluid communication with a vacuum source
Implementation Method 2
apply a vacuum to attach the die to the tool
Data Source
AI summary
Embodiments of the present disclosure provide die pick and place tools with an improved vacuum tip that can perform attachment and detachment of an integrated circuit die without deforming dies. In one embodiment, a vacuum tip for transporting an integrated circuit die is provided. The vacuum tip includes a body having a top surface and a bottom surface, a plurality of grooves formed in the top surface and into the body, wherein the grooves extend radially outward from a center point of the body. The vacuum tip also includes a channel in the body, wherein the channel extends from a bottom of the grooves through the body to the bottom surface of the body, and the channel and the body are substantially co-axial.