Grooved Endpoint Detection Window for CMP Pad Bonding

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Solution Overview

Problem

Chemical mechanical polishing pads with smooth contact surfaces suffer from poor bonding between the window and the polishing pad, leading to gaps, cracks, and leakage of polishing solutions due to inadequate adhesion.

Innovation Solution

The introduction of a column-shaped endpoint detection window with a multi-groove structure on its side surface, where the grooves have a controlled maximum circumferential depression depth, radial width, and depression area, integrated with a polyurethane polishing pad through a molding process, enhancing the bonding strength and stability.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If a smooth contact surface is used for the window, then the manufacturing process is simple, but the bonding strength between the window and the polishing pad is insufficient

Engineering Contradiction:
Improvemanufacturing simplicityVSAvoidbonding strength
Core Design Contradiction:
Ease of manufactureVSStrength

Solution Approach 1:

The side surface of the window is segmented into multiple circumferential grooves, dividing the contact interface into multiple bonding zones. This segmentation increases the total bonding contact area and creates multiple embedded connection points between the polishing pad material and the window, significantly improving bonding strength while maintaining a relatively simple manufacturing process through groove formation.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The bonding interface is extended from a two-dimensional smooth surface to a three-dimensional grooved structure. By adding circumferential grooves with specific depth and width, the contact surface gains depth dimension, creating embedded bonding zones that enhance the mechanical interlocking between the window and polishing pad, thereby improving bonding strength.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Strength

If the grooves are too deep or too wide, then the bonding contact area increases, but the structural integrity of the window may be compromised

Engineering Contradiction:
Improvebonding strengthVSAvoidstructural integrity
Core Design Contradiction:
StrengthVSReliability

Solution Approach 1:

The groove dimensions are optimized within specific parameter ranges: groove depth of 0.5-3 mm and groove width of 0.5-5 mm. These parameter changes balance the competing requirements by creating sufficient bonding contact area while maintaining the structural integrity of the window. The controlled parameters ensure that the grooves provide enhanced bonding without compromising the overall strength of the window structure.

Inventive Principle:
Principle #35Parameter changes

Data Source

PatentUS20240009797A1Endpoint detection window, chemical mechanical polishing pad with window and preparation method thereof
Publication Date: 2024.01.11 INVENTECH MATERIALS CO LTD
  • US20240009797A1 patent drawing
  • US20240009797A1 patent drawing
  • US20240009797A1 patent drawing

AI summary

The present invention relates to B24B, and more specifically, the present invention relates to an endpoint detection window, a chemical mechanical polishing pad with a window and a preparation method thereof. A side surface of the window is provided with a plurality of circumferential grooves. In the present invention, a column-shaped window with a specially designed side surface structure is provided and subjected to integrated pouring and molding with a polishing pad to manufacture a chemical mechanical polishing pad having high bonding strength between the window and the polishing pad. As a side surface of the window is of a multi-groove structure, not only is the bonding contact area between the window and the pad increased, but also a convex structure is formed by a polishing pad body material poured into the grooves so as to form an embedded bonding manner with a groove structure of a window material.