Grooved Printed Wiring Board With Oxidation-Resistant Metal Particle Layer
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Solution Overview
Problem
The existing printed wiring boards face issues with oxidation of the circuit at the interface with the groove, leading to potential peeling of the circuit from the groove.
Innovation Solution
A printed wiring board design that includes a base film with grooves containing a wiring line composed of a metal particle layer bonded by metallic bonding, partially coated with an organic film, and a plating layer, which suppresses oxidation at the interface.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a circuit is provided in a groove without additional protective coating, then manufacturing process is simple, but the circuit undergoes oxidation at the interface with the groove leading to peeling
Solution Approach 1:
The patent applies composite materials by combining metal particles (copper or silver) with an organic film coating. The metal particles provide electrical conductivity while the organic film provides oxidation resistance. This composite structure prevents circuit oxidation at the groove interface without complicating the manufacturing process, as the organic film is applied directly to the metal particle layer in the existing groove structure.
2Reliability
If the circuit surface is fully coated with organic film, then oxidation resistance is improved, but adhesion to groove surface may be insufficient
Solution Approach 1:
The patent applies local quality by partially coating the metal particle layer with organic film rather than fully coating it. The organic film is applied to protect the circuit from oxidation at critical interfaces while leaving portions of the metal particle layer exposed to maintain strong adhesion to the groove surface. This selective coating approach ensures both oxidation resistance and adequate adhesion strength.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively prevents oxidation and peeling of the wiring line at the groove interface, allowing for improved manufacturing efficiency and reliability, especially when using copper or silver metal particles with a specific molecular weight range for the organic film.
Implementation Method 1
The metal particle layer contains a plurality of metal particles bonded to each other by metallic bonding
Implementation Method 2
A surface of each of the plurality of metal particles is partially coated with an organic film... capable of suppressing oxidation of the wiring line at the interface with the groove
Data Source
AI summary
A printed wiring board includes a base film having a first major surface provided with a groove, and a wiring line disposed in the groove. The wiring line includes a metal particle layer disposed at least on a bottom surface of the groove and a plating layer disposed on the metal particle layer. The metal particle layer contains a plurality of metal particles bonded to each other by metallic bonding. A surface of each of the plurality of metal particles is partially coated with an organic film.