Ground Ring Assembly with Movable Blocks for Plasma Uniformity
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Solution Overview
Problem
Plasma processing apparatuses face challenges in achieving uniform etching due to asymmetric plasma distribution on substrates, leading to non-uniformity in semiconductor devices.
Innovation Solution
A substrate support apparatus with a ground ring assembly featuring an annular-shaped ground ring body and movable conductive ground blocks, which are electrically grounded and adjustable to control the impedance of ground paths, ensuring uniform plasma distribution by removing electrons and compensating for asymmetry.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a ground ring assembly with movable ground blocks is used to control impedance, then etching uniformity is improved, but device complexity increases
Solution Approach 1:
The ground ring assembly is divided into multiple discrete ground blocks that can be independently positioned and adjusted. Each ground block can be selectively received into recesses at different positions around the substrate stage, allowing localized impedance control to achieve uniform etching across the wafer surface.
Solution Approach 2:
The ground blocks are designed to be movable rather than fixed, enabling dynamic adjustment of their positions around the substrate stage. This mobility allows the system to adapt impedance distribution to compensate for asymmetric plasma patterns and achieve uniform etching under varying process conditions.
2Manufacturing precision
If ground blocks are made movable to adjust impedance distribution, then azimuthal non-uniformity is reduced, but ease of operation decreases
Solution Approach 1:
The ground ring is segmented into multiple independent ground blocks that can be individually positioned. This segmentation allows precise control of impedance at specific azimuthal locations to correct non-uniformity patterns without requiring complex global adjustments.
Solution Approach 2:
The ground blocks are designed to be self-adjusting through their movable configuration, where their positions can be optimized to naturally compensate for asymmetric plasma distribution patterns that occur during processing, reducing the need for complex external control mechanisms.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively improves azimuthal non-uniformity on wafers by mechanically adjusting the ground ring assembly's impedances, enhancing etching uniformity and reducing asymmetry in semiconductor device manufacturing.
Implementation Method 1
a plurality of ground blocks movable to be received into respective recesses of the plurality of recesses, the plurality of ground blocks including a conductive material to be electrically grounded
Data Source
AI summary
A substrate support apparatus includes a substrate stage to support a substrate, and a ground ring assembly along a circumference of the substrate stage, the ground ring assembly including a ground ring body, the ground ring body having a plurality of recesses along a circumferential portion thereof, and a plurality of ground blocks movable to be received into respective recesses of the plurality of recesses, the plurality of ground blocks including a conductive material to be electrically grounded.