Grounded Conductive Electrode for TFT Array Static Discharge

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Solution Overview

Problem

During the manufacturing of active display devices, thin film transistor array substrates are exposed to the air, leading to the generation of high-voltage static electricity, which can cause irreparable damage due to instantaneous electric currents.

Innovation Solution

A conductive electrode is formed within the wiring region of the thin film transistor array substrate and grounded, allowing for the discharge of high-voltage static electricity without increasing manufacturing costs.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If the thin film transistor array substrate is exposed to air during manufacturing, then the manufacturing process can proceed normally, but high-voltage static electricity is generated causing irreparable damage to the panel

Engineering Contradiction:
Improvemanufacturing efficiencyVSAvoidpanel reliability
Core Design Contradiction:
ProductivityVSReliability

Solution Approach 1:

The patent applies preliminary action by pre-establishing a conductive layer in the insulating layer before the panel is damaged by static electricity. This conductive layer is positioned to receive and discharge static electricity before it can cause harm, proactively preventing the harmful effect rather than reacting to it after occurrence

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The patent introduces a conductive layer as an intermediary element between the insulating layer and the harmful static electricity. This conductive layer acts as a mediator that intercepts and redirects the static electricity discharge path, protecting the underlying circuit structures from damage while allowing the manufacturing process to continue

Inventive Principle:
Principle #24Intermediary (Mediator)

2Reliability

If a protective measure against static electricity is added, then product reliability is improved, but manufacturing cost increases

Engineering Contradiction:
Improveproduct reliabilityVSAvoidmanufacturing cost
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The patent merges the static electricity protection function with the existing insulating layer structure by forming a conductive layer within the insulating layer itself. This integration approach combines multiple functions (insulation and electrostatic protection) into a single structural element, avoiding the need for separate protective components and reducing overall manufacturing cost

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The insulating layer is designed to serve multiple functions: providing electrical insulation and simultaneously housing a conductive layer for static electricity discharge. This multi-functionality eliminates the need for dedicated static protection structures, reducing device complexity and manufacturing cost while improving reliability

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution effectively discharges high-voltage static electricity, enhancing the reliability of the product by preventing damage during the module-assembly stage of the manufacturing process.

Implementation Method 1

a conductive electrode is formed within the wiring region and the conductive electrode is grounded... can discharge the high-voltage static electricity generated in the thin film transistor array substrate

Methodology Applied
Scientific EffectElectrostatic discharge: Electrostatic Discharge

Data Source

PatentUS8963160B2Thin film transistor array substrate, manufacturing method thereof and display device
Publication Date: 2015.02.24 BOE TECHNOLOGY GROUP CO LTD
  • US8963160B2 patent drawing
  • US8963160B2 patent drawing
  • US8963160B2 patent drawing

AI summary

Embodiments of the present invention disclose a thin film transistor array substrate, a manufacturing method thereof, and a display device. The thin film transistor array substrate comprises: an active pixel region and a wiring region, in which a conductive electrode is formed within the wiring region and the conductive electrode is grounded. The manufacturing method comprises: a thin film transistor array is formed within an active pixel region of a substrate; and a conductive electrode is formed within a wiring region located at the periphery of the active pixel region.