Grounded Interposer Shielding for Compact Electronic Packages
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Solution Overview
Problem
Conventional semiconductor packages are vulnerable to external electromagnetic interference, leading to operational issues and potential damage of semiconductor elements.
Innovation Solution
An electronic package design incorporating a carrier structure, interposer, and grounding wires to create a shielding effect, preventing electromagnetic interference by connecting the interposer to the carrier structure via wires.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If conventional chip scale package structure is used to achieve miniaturization, then package size is reduced to match chip size, but electromagnetic interference protection is insufficient
Solution Approach 1:
The patent implements a nested shielding structure where an inner shielding layer is placed within the package cavity close to the chip, and an outer shielding layer surrounds the package. This multi-level nested arrangement creates overlapping electromagnetic shielding zones that effectively block interference while maintaining compact dimensions.
Solution Approach 2:
The patent introduces grounding structures as intermediary elements that connect both shielding layers to ground potential. These grounding intermediaries provide a reference potential that enhances the shielding effectiveness by creating complete electromagnetic shielding zones between the signal elements and external interference sources.
2Object-affected harmful factors
If shielding structures are added to protect against electromagnetic interference, then electromagnetic protection is improved, but device complexity increases
Solution Approach 1:
The patent designs the shielding layers to serve multiple functions: they provide electromagnetic shielding, act as structural support elements within the package, and can be integrated with existing package substrates. This multi-functionality reduces the need for separate dedicated shielding components, thereby limiting complexity increase.
Solution Approach 2:
The patent merges the shielding structures with the package substrate and interconnection elements. The shielding layers are integrated into the existing package architecture rather than being added as separate external components, which streamlines the overall structure and reduces manufacturing complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively shields semiconductor elements from electromagnetic interference, ensuring normal operation and enhancing the reliability of the electronic package.
Implementation Method 1
at least one wire connected to the at least one second contact and the carrier structure and grounding the carrier structure
Data Source
AI summary
An electronic package is provided, in which an electronic element is disposed on a carrier structure, and an interposer is stacked on the electronic element. Further, a wire is connected to the interposer and grounds the carrier structure, such that the wire and the interposer surround the electronic element. Therefore, the wire can be used as a shielding element when the electronic package is in operation to prevent the electronic element from being subjected to external electromagnetic interference.