Group Bounding Box Placement for Integrated Circuit Layout Optimization
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Solution Overview
Problem
Conventional electronic design automation (EDA) tools lack the capability to automatically determine optimal placement constraints for integrated circuit cells, leading to lengthy manual iterative processes to achieve efficient circuit design.
Innovation Solution
The method involves defining a group bounding box for integrated circuit cells based on their centroid, width, and height, using an objective function that considers wire length and timing parameters to automatically place and size cells within the new layout, thereby mitigating timing delays and improving computational speed.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional EDA tools are used for manual iterative adjustment of bound locations and sizes, then placement precision can be improved through multiple simulations, but the design time increases to several months
Solution Approach 1:
The system performs automatic placement of cells within group bounding boxes using an objective function that evaluates wire length and timing parameters. The EDA tool autonomously determines optimal bound locations and sizes without requiring manual iterative adjustment by designers, thereby reducing design time from months to days while maintaining placement precision
Solution Approach 2:
The system changes the parameters of group bounding boxes (locations and sizes) automatically based on an objective function that considers wire length and timing constraints. This automated parameter optimization replaces manual iterative adjustment, achieving both precision and efficiency
2Manufacturing precision
If manual iterative adjustment of bound locations and sizes is performed, then placement quality can be improved, but the complexity of the design process increases
Solution Approach 1:
The system automatically determines group bounding box parameters and performs cell placement using an objective function, eliminating the need for manual iterative adjustment. This automation reduces design process complexity while maintaining placement quality
Solution Approach 2:
The manual mechanical process of iteratively adjusting bound locations and sizes is replaced by an automated computational system that uses an objective function to determine optimal placement, thereby reducing process complexity
3Productivity
If automatic placement based on objective function is implemented, then productivity is improved by reducing design time to a few days, but the requirement for complex algorithms increases
Solution Approach 1:
The system implements automatic placement using an objective function that evaluates wire length and timing parameters, enabling the EDA tool to autonomously determine optimal group bounding box configurations. This automation dramatically improves productivity by reducing design time from months to days
Solution Approach 2:
The system automatically optimizes multiple parameters including group bounding box locations, sizes, and cell placements within these boxes. The objective function simultaneously considers wire length and timing constraints to achieve optimal results efficiently
Data Source
AI summary
Among other things, one or more systems and techniques for defining a group bounding box for related cells of an integrated circuit, and generating a new layout for the integrated circuit comprising the group bounding box are provided herein. That is, one or more group bounding boxes are defined based upon positional values of related cells. Such group bounding boxes are placed within the new layout based upon a placement technique, such as an objective function that takes into account wire length, timing, and cell density, for example. The one or more group bounding boxes are sized or reshaped to reduce cell overlap within the new layout. In this way, the new layout comprises related cells, bound by one or more group bounding boxes, that are placed within the new layout according to a configuration that mitigates wire length and timing delay of the integrated circuit.